本科毕业设计（论文）硅片自旋转磨削工艺规律研究学院机电工程学院专业机械设计制造及其自动化(机械电子方向）年级班别2008级(2)班学号3018000383学生姓名王展浩指导教师魏昕2012年5月21日硅片自旋转磨削工艺规律研究王展浩机电工程学院硅片自旋转磨削工艺摘要单晶硅片是集成电路(IC)制造过程中最常用的衬底材料，硅片的表面层质量直接影响着器件的性能、成品率以及寿命。随着硅片尺寸的增大，新的硅片高效超精密平整化加工工艺得到了大量的研究。其中，具有高效率、高精度、低损伤等优点的硅片自旋转磨削技术正逐步成为抛光硅片和图形硅片背面减薄的主流加工技术。本文利用基于自旋转磨削原理的硅片超精密磨床，通过试验研究了砂轮磨粒粒度、砂轮进给速度和砂轮转速等主要因素对磨削后硅片的磨削力和表面质量的的影响关系。关键词：硅片,磨削,砂轮,磨床,自旋转磨削注：本设计题目来源于教师的国家级科研项目，项目编号为：U0734008。AbstractSiliconintegratedcircuit(IC)manufacturingprocessmostcommonlyusedinthesubstratematerial,siliconwafersurfacequalitydirectlyaffectstheperformanceofthedevice,therateoffinishedproductsandlife.Alongwiththeincreaseofthesiliconwafersizes,newsiliconwaferefficientprocessingtechnologyoftheultraprecisionlevelofftogetalotofresearch.Amongthem,withhighefficiency,highprecision,lowdamageandotheradvantagesofthewaferrotationgrindingtechnologyisgraduallybecomingthepolishingofsiliconwaferandwaferbacksidethinningofthemainstreamgraphicsprocessingtechnology.Basedontherotationprincipleofgrindingsiliconwaferultra-precisiongrinder,grindingparticlesizewasstudiedbyexperiment,thegrindingwheelspeedandthespeedofthegrindingwheelmainfactorsongrindingwafergrindingforceandsurfacequalityofrelationship.Keywords:Siliconwafer,Grinding,Thegrindingwheel,Grindingmachine,Self-rotatinggrinding目录1绪论..........................................................................................................................................11.1前言................................................................................................................................11.2硅片超精密磨削的现状................................................................................................11.2.1国外现状..............................................................................................................11.2.2国内现状..............................................................................................................21.3硅片超精密磨削的发展趋势........................................................................................31.4硅片自旋转磨削的原理................................................................................................41.5本文研究的主要内容....................................................................................................52硅片自旋转磨削加工的实验设计..........................................................................................62.1实验设备的介绍............................................................................................................62.2工件的介绍....................................................................................................................62.3砂轮的选择....................................................................................................................82.4工艺参数的选择............................................................................................................92.4.1砂轮轴向进给的速度........................
