高级硬件工程师英文简历表格 VIP免费

此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。高级硬件工程师英文简历表格?考的材料，毕竟以后的工作都是围绕产品展开。Name：XXXHukou：ShanghaiResidency：ShanghaiWorkExperience：CurrentSalary：Tel：E-mail：www.XXX.comCareerObjectiveDesiredIndustry：Electronics/Semiconductor/IC,Science/Research,Government,Others,Testing,CertificationDesiredPosition：SeniorHardwareEngineer,SemiconductorTechnology,BranchOfficeManager,ChiefRepresentative,ResearchSpecialistStaffDesiredaddress：Shanghai,Hongkong,Beijing,Taiwan,MacaoDesiredSalary：NegotiableWorkExperience2020/06;Present***CompanyIndustry:Electronics/Semiconductor/ICIntelFlashEngineeringDepartmentIndividualContributorResponsibilities：IhavebeenworkinginIntelFlashAssembly&TestEngineeringDepartmentasanIndividualContributorsinceJuneof2020.BeingLeaderofATEYieldteam,Ihavebeenworkingwiththeteammemberstoimprovetheproductsyield.Oureffortsarepaidoff:Theyieldofyear2020hasbeendramaticallyincreasedthanthatofyear2020.Theyieldofallproducts,consecutivelymeetsthegoal.Thetotalamountofcostsavingduetoyieldimprovementismorethan$1millioncomparedwithyear2020.BeingtheLeaderofBoardRepairTeaminATE,Iworkedwithmyteammembers,setupasetofnewproceduretoreplacethecurrentone,Idefinedtheschedule,dividedtheroles&responsibilitiesamongteammembers,followuptheprogress.Finally,theteamhasmadeagreatcostsavingof$2.5Min2020.ReportDirectlyto:DepartmentManagerNumberofSubordinate:14Reference:BaoPowelAchievements:BeingLeaderofATEYieldteam,Ihavebeenworkingwiththeteammemberstoimprovethe此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。productsyield.Oureffortsarepaidoff:Theyieldofyear2020hasbeendramaticallyincreasedthanthatofyear2020.Theyieldofallproducts,consecutivelymeetsthegoal.Thetotalamountofcostsavingduetoyieldimprovementismorethan$1millioncomparedwithyear2020.BeingtheLeaderofBoardRepairTeaminATE,Iworkedwithmyteammembers,setupasetofnewproceduretoreplacethecurrentone,Idefinedtheschedule,dividedtheroles&responsibilitiesamongteammembers,followuptheprogress.Finally,theteamhasmadeagreatcostsavingof$2.5Min2020.2020/01;2020/05Intel(Shanghai)TechnologyDevelopmentLtd.CompanyIndustry:Electronics/Semiconductor/ICIntelSTTD-ChinaDepartmentElectronicsDevelopmentEngineerResponsibilities：IhadbeenworkinginSTTD-ChinasinceJan2020toMay2020asaseniormoduleengineer.Atthattime,asamaincontributorofthisproject,wesucceededindevelopingasetofMASSIVELYPARALLELCLASSTESTequipment,whichisabletotestmorethan6700unitsinonetime.ReportDirectlyto:HopmanMarkNumberofSubordinate:14Reference:BaoPowelReasonforLeaving:IwastransferredtoIntel（Shanghai）ProductsLtd.Companyduetotheinternalre-organizationinJuneof2020.Achievements:AsamaincontributorofSTTD-Chinadepartment,Ico-workwithmycolleaguestosucceedindevelopingasetofMASSIVELYPARALLELCLASSTESTequipment,whichisabletotestmorethan6700unitsinonecycle.2020/05;2020/01NanyangUniversityofScience&TechnologyIndustry:Electronics/Semiconductor/ICElectronics&ElectricalEngineeringDepartmentResearchFellowResponsibilities：IworkinElectronics&ElectricalEngineeringDepartmentofNanyangUniversityofScience&TechnologyasaResearchFellow.ImajoredatGateOxideReliabilityResearchintheduration.ReportDirectlyto:此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。ProfessorPeyKinLeohSubordinate:3Reference:P...