JOINT INDUSTRY STANDARDSolderability Tests for Component Leads, Terminations, Lugs, Terminals and WiresEIA∕IPC∕JEDEC J-STD-002ENovember 2017 Supersedes J-STD-002D June 2013EC1A. I PC and JEDEC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmenιber of ECIA. I PC or JEDEC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA. IPC or JEDEC members, whether the standard is to be used either domestically or internationally.Recommended Standards and Publications are adopted by EC1A. IPC or JEDEC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, ECIA. IPC or JEDEC do not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for M>tecUng themselves against all claims of liabilities for patent infringement. The materia! in this joint standard was developed by the IPC Components and Wire Solderability Specification Task Group (5-23b) of the Assembly and Joining Processes Committee (5-20). the Electronic Components Industry Association Soldering Technology Committee (STC) and the JEDEC Solid State Technology Association Committee (...
