目 录1．系统设计与框图..................................................22.系统硬件主要电路.................................................22.1MSP430 单片机模块...................................................................22.1.1 MSP430 单片机工作特点........................................................32.1.2 MSP430 单片机最小系统........................................................32.2 LCD1602 液晶显示模块...............................................................42.2.1 LCD1602 引脚功能.............................................................42.2.2 LCD1602 指令说明.............................................................52.2.3 LCD1602 操作时序.............................................................62.3.DS18B20 温度采集模块...............................................................72.3.1 DS18B20 封装形式及引脚功能...................................................72.3.2 DS18B20 内部结构.............................................................82.3.3 DS18B20 测温原理.............................................................92.4.串口通信模块.....................................................................102.4.1 串行通信概述...............................................................102.4.2 RS232 接口电路..............................................................113.系统软件设计....................................................123.1 主程序............................................................................133.2 DS18B20 温度采集程序..............................................................133.3 LCD1602 液晶温度显示程序..........................................................153.4 串口程序..........................................................................164 .系统调试与结果分析.............................................174.1 LCD1602 液晶温度显示..............................................................174.2 串口通信上位机温度显示.................................
