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******公司设计规范状态：受控编号：编制：审核：批准：批准日期：年月日实施日期：年月日PCB设计规范PCB设计规范修订记录日期修订版描述作者目录1.范围..................................................................12.规范性引用文件........................................................13.术语和定义............................................................13.1.印制电路板（PCB－printedcircuitboard）.......................13.2.原理图（schematicdiagram）....................................13.3.网络表（SchematicNetlist）....................................13.4.背板（backplaneboard）........................................13.5.TOP面..........................................................23.6.BOTTOM面.......................................................23.7.细间距器件.....................................................23.8.StandOff......................................................23.9.护套...........................................................23.10.右插板.........................................................23.11.板厚（boardthickness）........................................23.12.金属化孔（platedthroughhole）................................23.13.非金属化孔（NPTH—unsupportedhole）...........................23.14.过孔（Viahole）...............................................23.15.盲孔（blindvia）..............................................23.16.埋孔（埋入孔，buriedvia）.....................................23.17.HDI（HighDensityInterconnect）..............................33.18.盘中孔（Viainpad）...........................................33.19.阻焊膜（soldermaskorsolderresist).........................33.20.焊盘（连接盘，Land）...........................................33.21.双列直插式封装(DIP—dual-in-linepackage）....................33.22.单列直插式封装(SIP—single-inlinepackage）...................33.23.小外型集成电路(SOIC—small-outlineintegratedcircuit）.......33.24.BGA（BallGridArray）........................................33.25.THT(ThroughHoleTechnology)...................................3PCB设计规范3.26.SMT(SurfaceMountedTechnology)...............................33.27.压接式插针.....................................................33.28.波峰焊（wavesoldering）.......................................33.29.回流焊（reflowsoldering）.....................................43.30.压接...........................................................43.31.桥接（solderbridging）........................................43.32.锡球（solderball）...........................................43.33.锡尖（拉尖，solderprojection）................................43.34.立片（器件直立，Tombstonedcomponent）.........................43.35.当前层（Activelayer）.........................................43.36.反标注（反向标注，Backannotation）............................43.37.FANOUT.........................................................43.38.材料清单（BOM－Billofmaterials）.............................43.39.光绘（photoplotting）..........................................43.40.设计规则检查（DRC－Designruleschecking）.....................53.41.DFM（DesignForManufacturability）............................53.42.DFT（DesignForTestability）..................................53.43.ICT（In-circuitTest）.........................................53.44.EMC（Electromagneticcompatibility)..........................