表面组装技术现状与展望 0702班刘辉小组VIP专享VIP免费

题目：表面组装技术现状与展望系（部）：电子科学与技术系专业班：电子科学与技术0702班姓名：刘辉U200714499姓名：黎奇U200714395姓名：吴鹏U200714449姓名：熊晨0120060165252011年01月第1页共27页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第1页共27页目录摘要..................................................................................................................................................2Abstract..........................................................................................................................................31表面组装技术的发展概况............................................................................................................42表面组装技术的特点...................................................................................................................53表面组装技术的组成...................................................................................................................63.1表面组装元器件(SMC/SMD)..............................................................................................63.1.1表面组装元器件基本要求......................................................................................63.1.2表面组装元器件的焊端结构..................................................................................83.1.3表面组装元器件(SMC/SMD)的包装类型...............................................................93.2表面组装技术的组装类型................................................................................................93.3SMT生产线及SMT生产线主要设备..............................................................................103.3.1SMT生产线分类...................................................................................................113.3.2SMT生产线主要设备...........................................................................................113.4表面组装的PCB...............................................................................................................133.5表面组装焊接材料..........................................................................................................133.5.1焊膏.......................................................................................................................133.5.2贴片胶...................................................................................................................143.6表面组装工艺..................................................................................................................143.6.1涂敷工艺...............................................................................................................143.6.2贴装元器件工艺....................................................................................................143.6.3再流焊工艺............................................................................................................163.6.4波峰焊工艺............................................................................................................174表面组装技术的现状及发展趋势..............................................................................................184.1元器件的发展................................................................................................................184.2材料发展..................................................