世界半导体生产机台安全设计验收标准(doc111)英文VIP免费

GlobalSemiconductorSafetyServices,LLCSEMIS2-93AProductSafetyAssessmentFinalReport世界半导体生产机台安全设计验收标准AppliedMaterialsChemicalMechanicalPolishingSystemModel:MirraTrakCMP工艺应用材料June19,1998Preparedfor:AppliedMaterials3111CoronadoDriveSantaClara,CA95054Preparedby:GlobalSemiconductorSafetyServices,LLC1313GenevaDriveSunnyvale,CA94089GS3JobNo.980029GS3DocumentNo.980029F2Client-Confidential保密合约TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterials’engineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.ThisinformationwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.AllobservationsandrecommendationsarebasedonconditionsanddescriptionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.Thisreport'ssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveysmade.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices’servicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices’expresswrittenconsent.Theserviceperformedhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServices’staff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.TABLEOFCONTENTS目录SectionPageNo.Section1.0MANAGEMENTSUMMARY(管理摘要)..........................................................1Section2.0SCOPE(范围)............................................................................................................2Section3.0SYSTEMDESCRIPTION(系统描述)......................................................................4Section4.0ASSESSMENT&TESTINGMETHODOLOGIES(试验方法)..............................5Section5.0SAFETYASSESSMENT(安全评估).......................................................................75.1PURPOSE(目的)95.2SCOPE(适用范围)105.3SAFETYPHILOSOPHY(安全体系)115.4GENERALGUIDELINES(指导方针)135.5SAFETY-RELATEDINTERLOCKS(安全互锁)185.6CHEMICALS(化学品)225.7IONIZINGRADIATION255.8NON-IONIZINGRADIATION265.9NOISE(噪音)275.10VENTILATIONANDEXHAUST(通风与排凤)285.11ELECTRICAL335.12EMERGENCYSHUTDOWN(紧急停机)415.13HEATEDCHEMICALBATHS455.14HUMANFACTORSENGINEERING465.15ROBOTICAUTOMATION525.16HAZARDWARNING(危险警告)535.17EARTHQUAKEPROTECTION(地震警告)545.18DOCUMENTATION(文件)575.19FIREPROTECTION(消防保护)605.20ENVIRONMENTALGUIDELINES(环境方针)62Section6.0RECOMMENDATIONS...............................................................................73Section7.0-ILLUSTRATIONS.......................................................................................76ILLUSTRATION1-MirraTrakSystemLayout77ATTACHMENTONE-SURFACELEAKAGECURRENTTEST(泄漏测试)....................