1SPECIFICATIONOFAPPROVAL规格承认书CUSTOMER/客户PRODUCTNAME/产品类别WIFIModuleCUSTOMERPRODUCTNO./客户产品编号MODELNo./产品型号DATE/日期2013.03.10EDITION/版本V:0ASUPPLER/供应者签署ACCEPTANCE/承认者签署深圳市普立晶电子有限公司深圳市普立晶电子有限公司PolycrystalElectronics(shenzhen)LIMITED地址：深圳市宝安区留仙二路创兴达商务中心6009Date/日期2013.03.10R&D./研发部陈志平Engineer/工程师王喜传Preparedby/制作王喜传21.IntroductionM17601A0isanewgenerationofembeddedPOLYC-WifiproductmoduleBasingonPOLYCinterface,Wifiwirelessnetworkstandardembeddedmodule,thebuilt-inwirelessnetworkprotocolIEEE802.11protocolstack,andTCP/IPprotocolstackmakethePOLYC-WifisaveelectricitybyitsintelligentcontrolproceduresThroughthePOLYC-Wifimodule,thetraditionalserialequipmentalsocaneasilyaccesswirelessnetwork.M17601A0isthesecondgenerationofproductswithupgradedcomprehensivehardwareandsoftware,whichmakesmorepowerfulfunction,easieruse,lowerpowerconsumption.Afterupgradingtheintelligentcurrentcontrolprogram,thissecondgenerationproductcansavemorethan40%electricity.Duringtemperaturecompensation,thelatestsoftwarecanautomaticallycontroltemperatureadjustment,whichwillnotaffectdatatransmission,andsolvingproblemsontraditionalproductsuchasdatalossbecausetoohightemperaturecausesfrequentoffline.etc.2.Features■M17601A0isasmallersizeandlowerpowermoduleonIEEE802.11b/g/nwirelessLAN.■M17601A0isbasedonMTK7601solution.■IEEE802.11b/g/nsingleBandWLANinfrastructure■Size:13.56mmx11.94mmx1.2mm■2.4GHzinternalPA■Twostreamspatialmultiplexingupto300Mbps■PIFAANT(1T1RMIMO)■Useon-chipOTP(One-TimeProgrammable)■WIFI:USB2.0■SupportsdriversforWindowsVista,2000,XP,Linux■Security:WPA,WPA2,AES(TKIP),WPS2.0，WAPI3•Application:■Smartphones■tabletPC,■MID,■PND,■PMP,■PortableGamingDevices3.OrderingInformationModelDescriptionM17601A0Wi-FiModule,SingleBand1T1RMIMO4.BlockDiagram45.AbsoluteMaximumRatingsNote:ThespecificationsinTable1definelevelsatwhichpermanentdamagetothedevicecanoccur.Functionoperationisnotguaranteedundertheseconditions.Operatingatabsolutemaximumconditionsforextendperiodscanadverselyaffectthelong-termreliabilityofthedevice.ParameterMinMaxUnitStorageTemperature-10+80℃℃StorageHumidity(40℃)-90%%
.Otherconditions1)Donotuseorstoremodulesinthecorrosiveatmosphere,especiallywherechloridegas,sulfidegas,acid,alkali,saltorthelikearecontained.Also,avoidexposuretomoisture.2)Storethemoduleswherethetemperatureandrelativehumiditydonotexceed5to40℃and20to60%.3)Assemblethemoduleswithin6months.Checkthesolderingabilityincaseof6monthsover.6.OperatingConditions7.StandardTestConditionsTheTestforelectricalspecificationshallbeperformedunderthefollowingconditionunlessotherwisespecified.1)AmbientconditionTemperature:25℃±5℃.Humidity:65%±5%R.H.2)Powersupplyvoltages5V(±5%)inputpowerattheModule3)Currentconsumptionoverrecommendedrangeofsupplyvoltageandoperatingconditionsislikebelow.Whenit’stested,itmustbesuppliedmorethan2timesofmaximalcurrent.MinTypMaxUnit0-60℃--85%SupplyVoltage1VBAT33.33.5VParameterOperatingTemperatureOperatingHumidity58.ElectricalSpecifications1）DCCharacteristics2)RFCharacteristicsforIEEE802.11b(11Mbpsmodeunlessotherwisespecified)NormalCondition:25℃,VDD=3.3/5VCurrentConsumptionMin.Typ.Max.UnitTXMode(MCS7)-80-IdleandAssociatedstate-25-Radiodisabledstate-10-mAItemsSpecificationModeChannelfrequency...
