【Altiu m 专题】——3D 封装技术 AndyZhou Altium Designer 的 3D 功能向来充满争议,曾经在与一些前辈交流的过程中,他们似乎对此功能不屑一顾,甚至取笑我“不务正业”,也许仁者见仁智者见智,当时心里觉得有落差,但是,面对质疑,我没有因此放弃对这一块的摸索,于是,才有了这一专题…要说 3D 功能有什么好处,最大的好处就是“所见即所得”,当时我 Layout 一块多路稳压电源的板子,发到工厂去打板,回来与 3D 预览一对照,几乎一模一样!(如上图)通常,我习惯 Layout 的时候检查元器件之间的干涉情况以及对照三维图手工焊接 PCB,有些时候,还能根据元器件的空间分布调整 PCB 板的大小,节省成本。以往,我都是先有 PCB 封装,再有 3D Body,最近,我有幸看到了 Altium 的官方视频,进而学会了新的技能——从 3D 模型生成 PCB FootPrint。☺ 【Altium 专题】 AndyZhou QQ:1140113479 1 目录 1. 为何使用3D 封装 ··········································································· 2 2. “自力更生” ················································································ 5 2.1 准备二维封装 ················································································ 5 2.1.1 测量数据················································································· 5 2.1.2 绘制丝印················································································· 5 2.2 面动成体······················································································· 7 2.2.1 使用 3D Body 管理器 ·········································...