半导体专业词汇汇总

中文英文1号极限开关LS1(limit suitch 1)232 bus的使用寿命已到或线路短路或断路232 bus error488 bus的使用寿命已到或线路短路或断路488bus error5S(整理、整顿、清扫、清洁、修养)5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)5u之pp质滤心cartridge p.p 5uABC分类法ABC classificationAUTO模automatic molding systemA板A plateBT指示剂eriochrome black t indicatorB板B plateCO2气泡机CO2 bubblerDIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收Any device having a chip out greater than 0.5mm in width(or depth) and 1.25mm in length is rejectable.DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。The product is rejectable when pad support protrudes morethan 0.25mm from the end of the packagebody.(sop:0.15mm).DIP：不符合脚量规之脚弯拒收。Any device showing bent leads (in case of doubts use theapplicable gauge) is rejectable.DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或大脚以上厚度大于0.75mm，拒收。Non-uniform solder such that a lead exceeds the dimensionsof 0.4mm thick and 0.5mm wide below the seating plate, oran overall thickness of 0.75mm above the seating plane isrejectable.DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。Lead finish on the leads shall be smooth and continuousfrom lead tip up to and over bend of lead.DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。Ejector marks more than above the surface or more than0.5mm below the surface of the device is rejectable.DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectableexcluding 0.5mm from the body.DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm直径圆面积之沾污。Package leads shall be free from attached foreign materialexcept for foreign material located above the seating planeof the lead, not bigger than 0.15mm in diameter.DIP：由于冲切造成之支持棒残存凸出或...