微电子工艺原理 一、单项选择 1.The most common reticle reduction ratio used with step-and-scan exposure tools is（ ） a.1:1 and 4:1 b. 1:1 and 5:1 c.4:1 and 5:1 d.4:1 2. Which of the following processes are performed in the diffusion area? Circle all that apply. （ ） a. wafer cleans b.high temperature processing c.metallization d.polishing e.photoresist stripping 3.What are the three production areas where photoresist-coated wafers can be found? （ ） a.diffusion b.photolithography c.etch d.implant e.thin films f.polish 4. Which of the following is not a common production tool in the thin films area? （ ） a.plasma resist stripper b.CVD systems C. PVD systems d.rapid thermal anneal system e.sputtering system f.spin-on-glass dispense system 5.What does the term CMP stand for? （ ） a.chemically modulated photostabilizer b.chemical mechanical propellant c.chemicaly manipulated plasma d. chemical mechanical planarization 6.What is another name for CMP? （ ） a.etch b.implant c.polish d.diffusion 7.The term WET stands for（ ） a.wafer etch technology b. wet etch for titanium contancts c. wafer elastomeric treatment d. wafer electrical test 8. The data obtained from wafer test/sort is used to（ ） a.determine which wafers need to go through WET. b.determine which wafers need to go through backgrind. c.determines the die yield for each wafer. d.calculate cycle time for wafer production. 9.The wafer is tested twice in order to determine its product worthiness（ ） a.once after first metal etch and after the completion of the last wafer process step. b.once before the contanct etch and after the completion of the wafer process flow. c. once after the first ion implant and after the completion of the wafer process...
