)电子整机装配工艺规程整机装配工艺过程1.1 DDDDDDDD3.11.2DDDDDD1.3DDDDDDDDDDDD(箱、柜级)(插箱板级)(插件级)(元件级)第四级组装第三级组装第二级组装第一3.22)(1)⑵⑶⑷⑸1.4DDDDDDDDDD1)(1)(2)(3)2)(1)⑵⑶电子整机装配前的准备工艺2.11)3.13.1方式、\时间 fs电烙铁搪锡300±101搪锡槽搪锡<2901〜2超声波擔锡240〜2601〜2(1)3.33.3⑵3.43.4⑶元器件3.5(1)(2)2)1mm3.52mm2.22.2.13.63.6(a)3.6(b)3.73.62.2.2(1)(2)(3)(4)1/102mm3.710%2mmmmR2d(d2mm02mm3.83.9mm3.8(a)(b)3.9WR2W1mm(5)2.33.103.2去屏蔽层长度3.103.2工作电压/V去屏蔽层长度/mm&叩以下10〜20600〜300020—303000—1000030〜60(1)3.11(a)3.11(a)(b)3.10(b)⑵3.120.50.8mm3.123.132.42.4.13.132.4.248mm3.14Q98-1XXXxX'拉紧3.143.153.1550502.4.33.163.16'mi111缆3.173.17印制电路板的组装3.1DDDDDDDDD3.1.1刨刀片扁电缆端头3.183.18(1)3.181mm3.193.18⑵3.19(3)3.20(4)3.213.203.22(5)3.213.22粘合剂扎线扣(6)3.233.24(2)3.233.1.2(1)3.24(a)3.24(b)(c)⑻⑹©12(3)⑷3.2DDDDDDDDDDD3.2.1(6(6)3.2.2(1)3.253.25⑵整机调试与老化4.1DDDDDDDDDD4.1.1(4)(1)(2)(3)(4)4.1.2(1)(2)(3)(4)(5)⑹4.2DDDDDDD4.2.14.2.2(1)⑵40255270240.5⑶200(5)812244.2.3(1)⑵⑶⑷⑸⑹4.2.4(1)⑵⑶⑷⑸⑹⑺
