第一章 电子组装的基本概念、功能及进展趋势.....................................11.1 电子制造业............................................................11.2 表面贴装技术..........................................................1第二章 表面组装元器件.........................................................22.1 表面组装元件的命名方法................................................22.2 SMC/SMD 包装类型......................................................22.3 常用电子元器件介绍....................................................22.7 表面组装器件..........................................................32.7.1 片式二极管......................................................32.7.2 SOT 系列片式晶体管..............................................32.7.3 SOP 翼型小外形封装..............................................32.7.4 QFP 翼型扁平四方封装............................................32.7.5 SOJ J 型小外形封装..............................................32.7.6 PLCC 塑料有引脚芯片载体.........................................32.7.7 LCCC 无引脚陶瓷封装芯片载体.....................................32.7.8 BGA/CSP 球形栅格阵列封装........................................42.7.9 PQFN 方形扁平无引脚塑料封装.....................................42.8 表面组装元器件的包装方式与使用要求....................................4第三章 表面组装印制板的设计与制造.............................................43.1 印制电路板的定义及作用................................................43.2 PCB 分类..............................................................53.3 常用印制电路板的基板材料..............................................53.3.1 纸基 CCL........................................................53.3.2 环氧玻璃布基 CCL................................................53.3.3 复合基 CCL......................................................53.3.4 金属基 CCL......................................................63.3.5 陶瓷基 CCL...............................
