毕业设计（论文）报告题 目 光刻工艺的讨论 系 别 尚德光伏学院 专 业微电子技术（液晶显示技术与应用）班 级 0902 学生姓名 赵俊 学 号 090425 指导老师 丁兰 2025 年 4 月光刻工艺的讨论摘要：光刻工艺是半导体制造中最为重要的工艺步骤之一。最重要的光刻工艺是在晶圆便面建立图形复制到硅片上，为下一步进行刻蚀或者离子注入工序做好准备。最后的步骤则是光刻胶的显影到最终检验。本文主要介绍了传统光刻技术和高级光刻工艺。开始介绍了光刻工艺的概述，以及光刻蚀工艺的概况。系统介绍了关于光刻蚀和光刻胶的内容，包括光刻胶的组成及正负胶的比较。然后以传统的十步法分类解析其内容，系统的介绍了这十步流程，然后介绍了光刻质量的分析方法。最后为了展望未来光刻工艺的前景，本文又介绍了高级光刻工艺技术，先是提出集成电路中存在的问题，然后介绍了两种新型的光刻工艺技术，进一步深化我们对于光刻工艺的新技术、新工艺的认识。关键词：光刻胶、曝光、最终检验、前景Semiconductor Lithography TechnologyAbstract：Lithography is one of the most important process in semiconductor manufacturing steps. Photolithography process is the most important established copy the graphic to the silicon wafer surface, ready for etching or ion implantation process to be done next. Last step is photoresist developer to the ultimate test. This article primarily describes traditional lithography and advanced Photolithography process. Start the overview of lithography, etching and lithography profiles. Corrosion system introduced on the lithography and photoresists, including composition of the photoresist and positive and negative comparison of rubber. And then the traditional ten-step classification analysis of their content, describes the ten steps of system processes and describes quality analysis method of lithography. Finally in order to look to the future prospects of lithography, this article also describes advanced lithography technology, first raised problems in the integrated circuit,...
