一.TFT工艺流程中英文标准名称ArrayProcessFlow阵列段工艺流程Input投料Unpacking拆包装Initialclean预备清洗Particlecount尘埃粒子测试Gate栅电极层Cleanbeforedepo成膜前清洗Gate(Mo/Alalloy)Filmdepo栅电极成膜RSmeter电阻测量MacroInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry(VCD)光刻胶低压干燥PRsoftbake前烘Expose曝光TitlerExpose/EdgeExpose打标/边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Mic/MacInspection宏微观检查CDafterdevelop显影后关键尺寸检查Totalpitch长寸测量GateWetetch栅电极湿刻Contactangle接触角测量PRstrip光刻胶剥离CDafteretch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查LaserRepair激光修补Active层Cleanbeforedepo成膜前清洗ActivefilmdepoActive成膜AOI自动光学检查MacroInspection宏观检查ThicknessMeasurement厚度测量CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Mic/MacInspection宏微观检查ActivefilmDryetch&AshingActive膜干刻与灰化ThicknessMeasurement厚度测量PRstrip光刻胶剥离AEI刻蚀后自动光学检查Mic/MacroInspection宏微观检查S/D源/漏电极层Cleanbeforedepo成膜前清洗S/DMofilmdepo源/漏电极成膜RSmeter电阻测量MACROInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Edgeexpose边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查MIC/MACInspection宏微观检查CDafterdevelop显影后关键尺寸检查Hardbakebyoven烘炉坚膜S/DMoWetetch源电极/漏电极湿刻n+a-SiDryetchn+高掺杂膜干刻PRstrip光刻胶剥离ThicknessMeasurement厚度测量CDafteretch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查CleanbeforeO/Stest短路/开路测试前清洗Open/ShortTest短路/开路测试Passivation保护层Cleanbeforedepo成膜前清洗Pass'nfilmdepo保护膜成膜AOI自动光学检查MACROInspection宏观检查ThicknessMeasurement厚度测量CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Edgeexpose边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Micro/MacroInspection宏微观检查SinXDryetch&ASHING氮化硅干刻与灰化PRstrip光刻胶剥离AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查ITOITO层CleanbeforePR成膜前清洗a-ITOfilmdepoITO成膜RSmeter电阻测试Anneal煺火MacroInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Micro/MacroInspection宏微观检查ITOfilmetchITO膜湿刻PRstrip光刻胶剥离AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查FinalE/T最终电测Anneal煺火Arraytest阵列测试Arrayrepair阵列修补TEGtestTEG测试Sort分级CellProcessflow制盒段工艺流程CFInput彩膜投料CFInitialClean彩膜预备清洗CFAOI彩膜自动光学检查CFSort彩膜分级PI配向膜CleanbeforePI配向膜涂布前清洗PIPrint配向膜涂布Pre-cure预固化PIInspection配向膜检查PIThicknessMeasurement配向膜厚度测量Main-cure固化PIrework配向膜返工ODFCF&TFTMatchingCF&TFT匹配Rubbing配向摩擦RubbingInspection摩擦检查Loader&Unloader上料机/下料机Buffer缓冲器CSTBuffer工装栏缓冲器Rotation/CoolingUnit旋转/冷却单元TurnAlignUnit旋转/对位单元TurnOverUnit翻转单元AfterRubbingCleaner摩擦后清洗SpacerSpray衬垫球散布SpacerCounter衬垫球计数Spacerrework衬垫球返工SpacerCure衬垫球附着固化ShortDispense导电胶涂布SealantDispense边框胶涂布SealInspection边框胶检查LCDispense液晶滴下VacuumAssembly真空贴合UVCure紫外线固化Mis-alignmentcheck错位检查SealOven边...