发行日期IssuingDate版本号Revision修改事项ProceedingA首版发行Firstversionissue1、Purpose目的ThisdocumentprovidestemplatesforrecordingpackagequalificationdataforRFMDproductandinstructionsforcomplyingwithMaterialsDeclaration.提供记录RFMD产品考核认证所需信息资料的模板,及遵从物质申明的说明2、Scope范围ApplytoRFMDpackagequalification适用于RFMD考核认证产品3、Instruction说明3.1MaterialsDeclaration:TheSubcontractorAssemblyhouseisrequiredtosubmitMaterialsDeclarationformslistingtherequiredbanned,bannedwithacceptablethresholdlevel,reportableorothermaterialsrequiredbyRFMDQAL-21-1028forassembliesmanufacturedforRFMD.Thesearerequiredforcurrentandnewassembliesandmustbeupdatedwhenevermaterialchangesoccurorwheneveranewsubstrateprocessdevelopmentorassemblyqualificationbegins.Thesupplierwillberequiredtoprovideproofofcompliancywithachemicalanalysis.SeeQAL-21-1028fordetailsonrequirements,reportingstructure,andreportingformat.物质申明:外包封装厂需要提交物质声明书，列明禁用材料，禁用但可接受门限的材料、需告知的或其他由RFMDQAL-21-1028文件规定的用于RFMD封装制造产品的材料.这些规定适用于现有及未来新的封装产品,当材料变更,新基板工艺流程的开发或开始封装考核认证时都要提交该声明书.供应商还需要提供化学分析作为依据.参考QAL-21-1028文件中的详细要求,报告的结构和格式。3.2Addlines,inserttables,embedobjectsateachapplicableprocesssteptocapturepertinentprocessdata.各工序可根据需收集的相关信息资料增加表格的行数,插入新的表格和对象3.3Compresspicturesonceallapplicableprocessinformationhasbeeninserted.Gotoviewtoolbars,selectpictures.Gotopicturestoolbarandcompresspictures,OK.完成相应的所有工序的信息资料后压缩图片.在视图工具栏中选择图片后压缩或在图片工具栏栏中压缩图片4、Reference参考CSR-CM012（PKG-21-1013）SubcontractorAssemblySpecificationforModulesCSR-CM029（QAL-21-1028）BannedSubstancesListandRFMDGreenDefinition5、QualificationData考核评估资料QualificationDataPartNumberQualLotNumberTraceCodePackageTypePackageSizeThickness拟制：审核：批准：WaferSizeThickness(listalldie)LeadCountPONumberMSLTargetLevelAssemblyLocationBondingDiagramPartNumberBOMPartNumberBrandingDiagramPartNumberPreparedByExecutiveSummaryYieldSummaryLot#1Lot#2Lot#3TotalYieldSMTYieldLot#1Lot#2Lot#3TotalYieldAssyYieldLot#1Lot#2Lot#3TotalYieldFinalYieldDataSummaryAllLotscombinedProcessTestCriteria±SSMaxMinAvgStdCpkSMTPasteThicknessSMTComponentShear(gramforcepereachSMDsize)SMTFluxThicknessDieAttachPlacementXDieAttachPlacementYDieAttachShear(eachdie)DieAttachRotationFlipChipAttachShear(eachdiesize)FlipChipAttachPlacementFlipChipAttachStandoffWireBondPullsDietoSubWireBondPullsDietoDieWireBondPullsSubtoSubWireBondPullsRSSBWireBondLoopHeightWireBondSpanWireBondPlacementXWireBondPlacementYWireBondBallShear>71umBPOWireBondBallShear>60<=71umBPOWireBondBallShear>52<=60umBPOWireBondSSBShear>71umBPOWireBondSSBShear>60<=71umBPOWireBondSSBShear>52<=60umBPOProcessTestCriteria±SSMaxMinAvgStdCpkWireBondBallshearonsubstratePlatingThicknessPlatingCompositionBallattachBallShearBallattachBallHeightSolderBumpBumpDiameterSolderBumpBumpCompositionSolderBumpBumpHeightSolderBumpBumpShearSolderBumpBumpCo-planarityonwaferSolderBumpBumpCo-planarityonDieSingulationSizeXSingulationSizeYSingulationSizeZSingulationRegistrationXSingulationRegistrationYSingulationCoplanarityTrim/FormTiptoTipTrim/FormStandoffTrim/FormCoplanarityConclusionsandRecommendationsBOMQualLot#1(repeatforquallot2and3...
