第1页共58页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第1页共58页目录第一章SMT概述....................................................................................................................................................41.1SMT概述.....................................................................................................................................................41.2SMT相关技术.............................................................................................................................................5一、元器件................................................................................................................................................5二、窄间距技术（FPT）是SMT发展的必然趋势...............................................................................5三、无铅焊接技术....................................................................................................................................5四、SMT主要设备发展情况...................................................................................................................61.3常用基本术语..............................................................................................................................................7第二章SMT工艺概述.............................................................................................................................................72.1SMT工艺分类.............................................................................................................................................7一、按焊接方式，可分为再流焊和波峰焊两种类型............................................................................7二、按组装方式，可分为全表面组装、单面混装、双面混装三种方式（见表2-1）.......................82.2施加焊膏工艺..............................................................................................................................................8一、工艺目的............................................................................................................................................8二、施加焊膏的要求................................................................................................................................9三、施加焊膏的方法................................................................................................................................92.3施加贴片胶工艺..........................................................................................................................................9一、工艺目的............................................................................................................................................9二、表面组装工艺对贴片胶的要求及选择方法....................................................................................9三、施加贴片胶的方法和各种方法的适用范围..................................................................................112.4贴装元器件................................................................................................................................................11一、定义..................................................................................................................................................11二、贴装元器件的工艺要求...............
