目录一目的...........................................................................................................................................................4二使用范围...................................................................................................................................................4三引用/参考标准或资料..............................................................................................................................4四PCB绘制流程图....................................................................................................................................5五规范内容...................................................................................................................................................61印制板的命名规则及板材要求.........................................................................................................61.1印制板的命名规则...................................................................................................................61.2印制板的板材要求...................................................................................................................72印制板外形、工艺边及安装孔设计.................................................................................................72.1机械层设计..............................................................................................................................72.2PCB外形设计...........................................................................................................................72.3PCB工艺边及辅助工艺边设计：...........................................................................................92.4PCB安装孔要求.....................................................................................................................102.5禁止布线层设计....................................................................................................................103焊接辅助点的设计（只限回流焊工艺）.......................................................................................113.1基准点的设计.........................................................................................................................113.2定位孔的设计.........................................................................................................................123.3基准点、定位孔排布的特殊情况.........................................................................................134元器件封装设计和使用要求.........................................................................................................144.1器件封装库使用要求.............................................................................................................144.2元件封装设计原则.................................................................................................................145接插件的选择和定位.......................................................................................................................165.1接插件的选择.........................................................................................................................165.2接插件的定位.........................................................................................................................166印制板布局设...
