制程技术与材料分析工程目录1.產品設計之可製造性(DFM)作業...............................................................31.1.何謂DFM..................................................................................................31.2.DFM使用時機............................................................................................31.3.DFM的作業流程（圖1）.............................................................................31.4.DFM檢核表之訂定與使用............................................................................31.5.關鍵性的PCBDFM準則..............................................................................32.材料選用..........................................................................................32.1.–間接材料選擇錫膏選擇.............................................................................32.2.間接材料的選用準則-助焊劑..........................................................................32.3.–直接材料的選用準則印刷電路板(PCB).......................................................32.4.–直接材料的選用準則元件..........................................................................33.PCBA製程管制準則............................................................................33.1.材料儲存與取用..........................................................................................33.1.1.溼氣敏感元件..........................................................................................33.1.2.印刷電路板.............................................................................................33.1.3.錫膏材料................................................................................................33.2.SMT製程參數之制定準則.............................................................................33.2.1.錫膏印刷................................................................................................33.2.2.印刷機作業流程(OperationFlow)...........................................................33.2.3.零件置放................................................................................................33.2.4.迴焊......................................................................................................33.3.DIP製程參數之制定....................................................................................33.3.1.波焊......................................................................................................33.3.2.壓合製程介紹..........................................................................................33.3.3.裁板......................................................................................................33.4.PCB重工參數之制定...................................................................................33.4.1.BGA重工...............................................................................................33.4.2.溫度設定................................................................................................33.4.3.小錫爐...................................................................................................33.4.4.PCB重工參數之制定-Solderiron.............................................................34.製程精進與新材料/零件/製程之導入與驗證流程..............................................34.1.製程精進與新材料/零件/製程導入..................
