宏茂微电子(上海)有限公司ChipMOSTECHNOLOGIES(Shanghai)LTD.资料名称TITLE：EPOXYDIEBONDINGWORKINGINSTRUCTION银胶上片工程作业指导书页数PAGE：1OF17资料号码SPECNOMEAWCS-0002版本REV.B本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它形式使用THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFChipMOSTECHNOLOGIES(Shanghai)LTD.ANDSHALLNOTBEDISTRIBUTED,REPRODUCED,ORDISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFChipMOSTECHNOLOGIES(Shanghai)LTD.1.0PURPOSE目的Definethestandardoperatingprocedureofepoxydiebonding,whichtobefollowedbyoperators.制定银胶上片工程标准作业程序，以供作业人员之依循。2.0SCOPE范围OperatorsofD/Astation.上片站作业员。3.0RESPONSIBILITY权责OperationMFGOperator作业执行制造作业者M/CmaintenanceEE机台维护设备工程师ProcessdefiningProcess.Eng.制定作业制程工程师4.0DIFINITION名词定义NA5.0REFERENCE参考资料5.1RELATIONSPEC关联文件5.1.1MAAPCS-0010PROCESSCONTROLPROCEDUREFORASSEMBLY封装制程管制程序书5.2REFERENCEDOCUMENT参考文件5.2.1QABPCS-0005EnvironmentControlProcedure生产环境管制程序书5.2.2MEAWCS-0010EpoxyManagementandThawingWorkingInstruction银胶管理及回温作业指导书5.2.3QBASCS-00022ndOpticalInspectionCriteria二目视检查规格5.2.4QAAWCS-0003ProcessDeviationManagementWorkingInstructionForAssembly宏茂微电子(上海)有限公司ChipMOSTECHNOLOGIES(Shanghai)LTD.资料名称TITLE：EPOXYDIEBONDINGWORKINGINSTRUCTION银胶上片工程作业指导书页数PAGE：2OF17资料号码SPECNOMEAWCS-0002版本REV.B本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它形式使用THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFChipMOSTECHNOLOGIES(Shanghai)LTD.ANDSHALLNOTBEDISTRIBUTED,REPRODUCED,ORDISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFChipMOSTECHNOLOGIES(Shanghai)LTD.封装制程异常作业指导书5.3RELATIONFORM关联窗体5.3.1MEARCS-0004D/Bopticalinspectionrecord.D/B目视检查记录表5.3.2MEARCS-0005Epoxydiebonderparameterchecktable.Epoxy上片机参数点检表5.3.3MEARCS-0012HitachiDB-500diebonderparameterchecktableHitachiDB-500上片机参数点检表5.4REFERENCEFORM参考窗体5.4.1MEARCS-0011L/Fusagecontrolsheet.L/F用量管制表5.4.2MEARCS-0002Epoxyusagecontrolsheet.银胶使用记录表6.0SECURITY/SAFETY安全性NA7.0CONTENT作业内容7.1LeadFrameDieAttachoperation导线架上片作业7.1.1Equipment设备1.ESECDIEBONDER20072.HITACHIDB-5003.HITACHIDB-530A7.1.2Tool装置及治工具1.Microscope实体显微镜(8〜50X)witha4Wlamp;inspectingtable;materialframeforsemi-finishedproducts.(8〜50X)附4W日光灯；检视桌；半制品材料架。2.Cabinet储存柜宏茂微电子(上海)有限公司ChipMOSTECHNOLOGIES(Shanghai)LTD.资料名称TITLE：EPOXYDIEBONDINGWORKINGINSTRUCTION银胶上片工程作业指导书页数PAGE：3OF17资料号码SPECNOMEAWCS-0002版本REV.B本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它形式使用THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFChipMOSTECHNOLOGIES(Shanghai)LTD.ANDSHALLNOTBEDISTRIBUTED,REPRODUCED,ORDISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFChipMOSTECHNOLOGIES(Shanghai)LTD.FilledwithN2air,flowrate:5l/minatleast.使用氮气，流量5l/min以上。3.Tweezers镊子。4.Adjustingpen调笔。5.Fingercots,ductlessgloves,E.S.D.preventionequipment指套、无尘手套、静电防护装备。6.Magazinesandcarrytrays.盒子及携盘。7.Carvepen.刻笔。8.Vacuumpen.真空吸笔9.Teethmirror.牙镜7.1.3Material材料1.LeadFrame导线架（L/F）Requestedbycustomerso...
