多孔硅的制备与表征1多孔硅的制备与表征[摘要]多孔硅（PorousSi）是一种具有纳米多孔结构的材料，可以通过晶体硅或非晶硅在氢氟酸中进行阳极氧化来获得。多孔硅由于原料储备大，制作工艺简单，是一种很有潜力的材料。同时，多孔硅作为一种硅基纳米发光材料，由于具有与现有硅芯片集成容易、研制成本低以及发射光均匀、多色等优点而被国内外科学家广泛研究，现已成为20世纪90年代以来硅基纳米材料的主要代表。本论文在进行大量的文献调研基础上，对多孔硅的发展历史、形成机理、分类方法、制备方法及应用方向等进行了简要概述。本论文研究了多孔硅的制备技术和表征，用比较简单且经济实惠的方法制备了多孔硅，并比较了在不同条件下制得的多孔硅形貌特征和结构差异。[关键词]多孔硅；电化学方法；结构；光致发光PreparationandCharacterizationofthePorousSiliconElectronicInformationEngineeringSpecialtySIWen-fangAbstract:Poroussilicon(PS)isamaterialwithnanoporousstructure.Itcanbeobtainedthroughthecrystallinesiliconoramorphoussiliconanodicoxidationinhydrofluoricacid.Becauseofitsbigrawmaterialsreserveandsimplemanufacturingprocess,poroussiliconisapotentialmaterial.Atthesametime,asasilicon-basedmaterialwithlight-emittingfunction,poroussiliconhasbeenwidelyresearchedbyscientistsalloftheworldandbecomesarepresentofsilicon-basednanometermaterialsbecauseofitsmerits,suchaseasyintegratingwithsiliconchips,lowcost,severalcolorslightemittingetc.Basedonalotofliteratureinvestigation,thedevelopmenthistory,theformingmechanism,classification,preparationmethodandtheapplieddirectionoftheporoussiliconisbrieflyreviewedinthispaper.Thepreparationtechnologyandcharacterizationofporoussiliconisresearchedinthispaper.Asimpleandeconomicalmethodofthepreparationisusedintheexperiment.Besides,theappearancecharacteristicsandstructuraldifferencesoftheporoussiliconindifferentconditionsarediscussedinthispaper.Keywords:Poroussilicon;electrochemicalmethod;structure;photoluminescence多孔硅的制备与表征2目录1引言....................................................................12多孔硅基本原理与概述....................................................12.1多孔硅发展历史....................................................12.2.1Beale耗尽模型..............................................22.2.2扩散限制模型................................................22.2.3量子限制模型................................................22.3多孔硅的分类......................................................42.4多孔硅的制备方法..................................................52.4.1阳极腐蚀法..................................................52.4.2水热腐蚀法..................................................62.4.3火花放电法..................................................72.4.4化学腐蚀法..................................................72.5多孔硅的应用......................................................73多孔硅制备的实验过程....................................................83.1仪器和试剂........................................................83.2单晶硅片清洗......................................................83.3多孔硅制备........................................................83.4多孔硅表面处理....................................................93.4.1阳极氧化表面处理法.........................................103.4.2阴极还原表面处理法.........................................104多孔硅的微结构研究.....................................................104.1制备多孔硅的实验结果对比...........................
