产品名称无产品版本共28页无有源光器件的结构和封装分析：日期：拟制：日期：审核：日期：批准：日期：目录1有源光器件的分类....................................................................................................................52有源光器件的封装结构.............................................................................................................52.1光发送器件的封装结构.......................................................................................................62.1.1同轴型光发送器件的封装结构......................................................................................72.1.2蝶形光发送器件的封装结构..........................................................................................72.2光接收器件的封装结构.......................................................................................................82.2.1同轴型光接收器件的封装结构......................................................................................82.2.2蝶形光接收器件的封装结构..........................................................................................92.3光收发一体模块的封装结构................................................................................................92.3.11×9和2×9大封装光收发一体模块.................................................................................92.3.2GBIC（GigabitInterfaceConverter）光收发一体模块..............................................102.3.3SFF（SmallFormFactor）小封装光收发一体模块...................................................112.3.4SFP（SmallFormFactorPluggable）小型可插拔式光收发一体模块.......................122.3.5光收发模块的子部件...................................................................................................123有源光器件的外壳..................................................................................................................143.1机械及环境保护................................................................................................................143.2热传递..............................................................................................................................143.3电通路..............................................................................................................................153.3.1玻璃密封引脚..............................................................................................................153.3.2单层陶瓷.....................................................................................................................153.3.3多层陶瓷.....................................................................................................................163.3.4同轴连接器.................................................................................................................163.4光通路..............................................................................................................................173.5几种封装外壳的制作工艺和电特性实例............................................................................183.5.1小型双列直插封装（MiniDIL）...................................................................................183.5.2多层陶瓷蝶形封装（Multilayerceramicbutterflytypepackages）............................193.5.3射频连接器型封装..........................................
