集成电路标准封装封装说 U 明SC70TinShrinkSmallOutlineDIP/DILDualIn-linePackageCERDIP/CDIPCeramicDualIn-linePackageSDIP/SPDIPShrink(Plastic)DualIn-linePackageFDIPWindowedFrit-SealDualIn-linePackageMDIPMoldedDualIn-LinePackageSIP/SIPPSingleIn-line(pin)PackageZIPZig-ZagIn-linePackageLCCLeadlessChipCarrierChiCLCCCeramicLeadedCarrierCOBChipOnBoardJLCCJ-LeadedChipCarrierDFN/SONDualFlatNoLeadNackageTDFNThinDualFlatNoLeadUTDFNUltra-ThinDualFlatNoLeadPackagePackageTQFNThinQuadFlatNoLeadsPackageDualQuadFlatNoLeaMLFMicro-LeadframeLeadsPackage0.6mmMLPisafamilyofintegratedcircuitQFNpackagesSOP/SO/SOL/DSOSmallOutlinePackagesHSOPHeatSinkSmallOutlinePackageSSOPShrinkSmallOutlinePackage1.15mmSOJ/SOIJCSmallOutlineJ-leadTSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageMSOPMiniSmallOutlinePackageTVSOPThinVerySmallOutlinePackageQSOPQuarterSizeOutlinePackageSOICSmallOutlineIntegratedCircuitBQFPBumperedQuadFlatPackPQFPPlasticQuadFlatPackHQFPHeatSinkQuadFlatPackQFPQuadFlatPackRQFPPlasticPoweRQuadFlatPackCQFPCeramicQuadFlatPackTQFPThinQuadFlatPack(typ.height1・40mm)VQFPVeryThinQuadFlatPack(typ.height1・00mm)LQFPLowProfileQuadFlatPack(0・30/0.40/0.50/0・65mm)PGAPinGridArrayPPGAPlasticPinGridArrayCPGACeramicPinGridArrayFC-PGA/FCPGAFlip-ChipPinGridArraySPGAStaggeredPinGridArrayOPGAOrganicPinGridArrayRGReducedPinGridArrBGABallGridArray(typ.1.50mm/1.27mmpitch)PBGAPlasticBallGridArray(typ・1.50mm/1.27mmpitch)CBGCeramicBallGridArray(typ・1.50mm/1.27mmpitch)MBGAMetalBallGridArray(typ・1.50mm/1.27mmpitch)F FBGA FinePitchBallGridArray(typ・1.00mmpitch)FTBGAFinePitchThinBallGridArray(typ.1.00mmFBGFineLineBallGridArray(typ・1.0Ommpitch)UBGAUltraFineLineBallGridArray(typ.0・80mmpitch)SBGASuperBallGridArray(typ.0.80mmpitch)LGALandGridArrayFlatpackUSmilitarystandardizedprinted-circuit-boardsurface-mount-componentpackageMCMMulti-ChipModuleCCGA/CGAColumnGridArrayICpackagesLDCCLeadedChipCarrierUICCUniversalIntegratedCircuitCardLFCCustomizedleadframe-basedCSPFCCSPFlipChipChipScalePackageWCSPWafer-levelRedistributionCSP
