精品文档---下载后可任意编辑LSAWs 技术无损表征互连薄膜机械强度与界面粘附性的讨论的开题报告Title: Study of Non-destructive Characterization of Mechanical Strength and Interface Adhesion of Interconnect Thin Films using LSAWs TechnologyIntroduction:In recent years, thin film interconnects have gained much attention due to their wide-ranging applications in microelectronics and MEMS devices. However, the mechanical strength and adhesion of interconnects are critical parameters that determine their reliability and performance in various applications. Therefore, it is essential to develop reliable and non-destructive characterization techniques to evaluate these parameters.The Laser ultrasonic Surface Acoustic Wave (LSAW) technique is a promising non-destructive approach to investigate mechanical properties and interfacial adhesion of thin films. This technique is based on the generation and detection of surface acoustic waves using a pulsed laser and a transducer. The LSAW technique offers several advantages, such as non-contact, non-destructive, and high sensitivity to detect the mechanical properties of the thin film.Objectives:The primary objective of this study is to explore the LSAW technique's potential for non-destructive characterization of mechanical strength and interface adhesion of interconnect thin films. The specific objectives are:1. To prepare the thin film samples of different thickness and materials using the microfabrication technique.2. To develop the LSAW experimental setup and methodology for the measurement of mechanical properties and adhesion of the thin films.3. To investigate the effect of varying parameters such as laser energy, frequency, and thickness on the LSAW signal and mechanical properties of the thin films.精品...
