Protel应用课程设计—51单片机外围电路设计课程设计任务书题目:目录摘要..............................................................................................................................IABSTRACT.................................................................................................................II1.设计任务与要求.........................................................................................................11.1设计任务..............................................................................................................11.2设计要求..............................................................................................................11.3各模块实现方案..................................................................................................11.3.1数码管选择....................................................................................................11.3.2温度测量模块的选择....................................................................................11.3.3串口通信模块的选择....................................................................................21.3.4系统总体设计框图........................................................................................22．系统硬件设计与参数计算......................................................................................32.1单片机最小系统..................................................................................................32.2矩阵键盘..............................................................................................................42.3数码管显示电路设计..........................................................................................52.4串口通信电路设计..............................................................................................52.5DS18B20模块电路设计......................................................................................63电路原理图绘制........................................................................................................73.1DXP绘制电路原理图.........................................................................................73.2DXP绘制PCB图..............................................................................................103.2.1加载网络表..................................................................................................103.2.2PCB板的排版..............................................................................................113.2.3PCB板的布线.............................................................................................124．系统电路仿真........................................................................................................134.1数据输入和双机通信仿真................................................................................134.2温度检测模块仿真............................................................................................135．心得体会................................................................................................................14参考文献......................................................................................................................14附录..............................................................................................................................1...
