PCB专业术语大汇集VIP免费

第1页共16页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第1页共16页PCBJargon(PCB专业术语)AAbsorption吸收、吸入AcceleratedTest（Aging）加速试验、加速老化Accelerator加速剂、速化剂Accept/Acceptance允收AcceptableQualityLevel（AQL）允收品质水准Accuracy准确度ACF：Adhesivecopperfoil有胶铜箔Activator活化剂、添加剂比称为ActivatorActiveparts（Devices）主动零件，指积体电路或电晶体AdditionAgent添加剂AdditiveProcess加成法、分全加成、半加成及部份加成Adhesion附著力Adhesive胶类或接著剂Aging老化AirKnife风刀AmbientTemperature环境温度Ampere安培Amp-Hour安培小时AnnularRing孔环Anode阳极AnodeBag阳极带ANSI:AmericanNationalStandardInstitute美国标准协会Anti-FormingAgent消泡剂第2页共16页第1页共16页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第2页共16页AOI:AutomaticOpticalInspection自动光学检验Aperture开口APQP:AdvancedProductQualityPlanArray排列、阵列Artwork底片ASIC:ApplicationSpecificIntegratedCircuit特定用途的积体电路器AspectRatio纵横比、板厚与孔径之比值Assembly装配、组装ATE:AutomaticTestingEquipment自动电测设备AVL:ApprovedVenderList合格供应商BBackLight（BackLighting）背光法Back-UP垫板Backpanels/Backplanes背板、支持板，厚度较厚，BallGridArray（BGA）球脚车列（封装）Barrel孔壁BaseMaterial基材Batch批（同时间发料某一数量的板子）Bevelling切斜边Binder黏结剂Blackoxide黑氧化层，另有棕氧化（BrownOxide）BlindViaHole盲导孔Blister局部性分层或起泡Blockout封网，网板之空网处以水溶胶涂满BlowHole吹孔，PTH孔壁有破洞（void）所造成Boiler(WaterTubeBoiler/FireTubeBoiler)BOM:BillofMaterial用料表BondStrength结合强度BondingSheet(Layer)接合片、接著层，指PPBondingWire结合线，IC之晶片与PCB之引线Bow板弯Break-awayPanel可断开板或者说BreakAwayTabBreakPoint出像点、影像点Break-Out破出（钻孔破出开成断环情形）Bridging搭桥、桥接Brightener光泽剂BrushPlating刷镀BTU/BritishThermalUnit英制热量单位Bump突块BuriedViaHole埋导孔Burn-in高温加速老化试验Burning烧焦第3页共16页第2页共16页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第3页共16页Burr毛头Buy-off认可CCAD:ComputerAidedDesign电脑辅助设计CAM:ComputerAidedManufacturing电脑辅助制造CAT:ComputerAidedTesting电脑辅助测试Capacitance电容Carbide碳化物、碳化钨钻头CAR:CorrectiveActionReport改善报告CarbonTreatment活性碳处理Card卡板Carrier载体Cartridge滤芯Cathode阴极CCL:CopperCladLaminates铜箔基板Ceramics陶瓷Certificate证明书CFC氟氯碳化物Chloro-Fluoro-CarbonChamfer倒角、去掉直角CharacteristicImpedance特性阻抗Cheeklist检察清单Chip晶粒、晶片ChipOnBoard晶片黏著板CleanRoom无尘室(Class100)Cleanliness清洁度Clearance余隙、余环COB（ChiponBoard）晶片在板上直接组装COC（CertificateofCompliance）出货合格书COF（ChiponFlexiblePCB）COG（Chipglass）CoefficientofThermalExpansion热膨胀系数（CTE）ColdSolderJoint冷焊点ComponentHole零件孔ComponentSide组件面、零件面Conditioning整孔Conductivity导电度Connector连接器ContinuityTest连通性试验CopperFoil铜箔、铜皮CopperBall铜球CornerCrack镀通孔转角断角Cp:CapabilityofProcess制程能力指数第4页共16页第3页共16页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第4页共16页Crack裂痕Crazing白斑（基板外观上的缺点）Crosstalk杂讯、串讯Cure/Curing硬化、热化CurrentDensity（C.D.）电流密度（1ASD=9.1ASF）CurtainCoating液涂法DDatum基准点Deburring去毛头Defect不良缺点Degreasing脱脂Delamination分层、爆板Dent凹陷、缓和均匀的下陷Desmearing除胶渣Developer显像液Deviation偏差Device电子元件Dewetting缩锡DFM:DesignforManufacturing/DirtyforeignMateria...