线路板PCB专业英语词汇(制造、测试、缺陷名等)VIP免费

PCB英语词汇(一）1.综合词汇Printedcircuit印制电路Printedwiring印制线路Printedcircuitboard印制电路板Printedwiringboard印制线路板Printedcomponent印制元件Printedcontact印制接点Single-sidedprintedcircuitboard(SSB)单面印制电路板double-sidedprintedcircuitboard(SSB)双面印制电路板Multilayerprintedcircuitboard(MLB)多层印制电路板Rigidprintedcircuitboard刚性印制电路板Flexibleprintedcircuitboard挠性印制电路板Flex-rigidprintedcircuitboard挠性印制电路板Build-upprintedboard积层印制板Surfacelaminarcircuit(SLC)表面层合电路板B2itprintdboard埋入凸块互连印制板ALIVHMultilayerprintdboard层间全内导通多层印制板Chiponboard(COB)载芯片板Backplane背板Bareboard裸板Break-awayboard可断拼板Interconnection互连Conductorraceline导线Substrate基底Realestate基板面Conductorside导线面Componentside元件面Solderside焊接面Printing印制grid网格pattern图形Conductivepattern导电图形Non-conductivepattern非导电图形Legend字符Mark标志2．基材2.1基材的种类和结构Basematerial基材Laminate层压板Copper-cladlaminate(CCL)覆铜箔层压板Prepreg预浸材料Bondingsheet/bondinglayer粘结片Epoxyglasssubstrate环氧玻璃基板Copper-cladsurface铜箔面Foilremovalsurface去铜箔面Lengthwisedirection纵向crosswisedirection横向Corematerial内层芯材2.2基材的材料A-stageresinA阶树脂B-stageresinB阶树脂C-stageresinC阶树脂epoxyresin环氧树脂Polymer聚合物Photosensitiveresin感光性树脂Thermosettingresin热固性树脂Thermoplasticresin热塑性树脂Adhensive胶粘剂Curingagent固化剂Flameretardant阻燃剂opaquer遮光剂Polyesterfilm(PET)聚酯薄膜Polyimidefilm(PI)聚酰亚胺薄膜Polytetrafluoetylene(PTFE)聚四氟乙烯Non-wovenfabric非织布/无纺布Glassfiber玻璃纤维Glassfabric玻璃布Warp-wise经向Weft-wise纬向Copperfoil铜箔Eletrodepositedcopperfoil电解铜箔Rolledcopperfoil压延铜箔Resincoatedcopperfoil(RCC)涂树脂铜箔2.3基材的制造Polymerize聚合Thermoplastic热塑性Thermoset热固性Clad覆箔Layup叠层laminating层压Postcure后固化Curingtime固化时间Resinflow树脂流动度Resincontent树脂含量PCB英语词汇（二）3设计3.1通用术语Computer-aideddesign(CAD)计算机辅助设计Computer-aidedmanufacturing(CAM)计算机辅助制造Routing布线Layout布图设计Componentdensity元件密度Arry阵列3.2形状与尺寸Conductor导线Conductorwidth导线宽度Conductorspacing导线间距Conductorwidth/space导线宽度/间距Conductorlayer导线层Componenthole元件孔Mountinghole安装孔Supportedhole支撑孔Unsupportedhole非支撑孔Via导通孔Platedthroughhole镀通孔Blindvia(hole)盲孔Buriedvia(hole)埋孔Buried/blindvia埋/盲孔Anylayerinnerviahole(ALIVH)任意层内部导通孔Tooling/pilothole定位孔Landlesshole无连接盘导通孔Via-in-pad在连接盘中导通孔Pitch节距Finepitch精细节距3.3电气互连Interfacialconnection表面间连接Interlayerconnection层间连接Innerlayerconnection内层连接Pad,land连接盘Componentlead3.4其他Primaryside主面Secondaryside辅面Signallayer信号层Crosstalk串扰Capacitance电容Electromagneticinterference(EMT)电磁干扰Electromagneticshielding电磁屏蔽Impedance特性阻抗Inductance电感Coplanarity共面性（度）Corematerial芯板Thintypemultilayerboard薄型多层板Buriedandblindviaholemutilayerboard埋/盲孔多层板Buriedbumpinterconnectiontechnology(B2it)嵌入凸块互连技术Multichipmodule(MCM)多芯片模块Alignmentmark对准标记Registrationmark对位标记Layertolayerregistration层间重合度PCB英语词汇（三）4.制造4.1通用术语Subtractiveprocess减成法Additiveprocess加成法Semi-additiveprocess半加成法Full-additiveprocess全加成法Buildupprocess积层法Soldermaskonbarecopper(SMOBC)裸铜覆阻焊工艺Tenting掩蔽法Sequentiallamination顺序层压...