页眉内容1页脚内容金属前介质层（PMD）金属间介质层（IMD）W塞（WPLUG）钝化层（Passivation）acceptor受主，如B，掺入Si中需要接受电子Acid：酸actuator激励ADIAfterdevelopinspection显影后检视AEIAfteretchinginspection蚀科后检查AFMatomicforcemicroscopy原子力显微ALDatomiclayerdeposition原子层淀积Alignmark(key)：对位标记Alignment排成一直线，对平Alloy：合金Aluminum：铝Ammonia：氨水Ammoniumfluoride：NHFAmmoniumhydroxide：NHOHAmorphoussilicon：α-Si，非晶硅（不是多晶硅）amplifier放大器AMU原子质量数Analog：模拟的analyzermagnet磁分析器Angstrom：A（E-m）埃Anisotropic：各向异性（如POLYETCH）Antimony(Sb)锑arcchamber起弧室ARC：anti-reflectcoating防反射层Argon(Ar)氩Arsenictrioxide(AsO)三氧化二砷Arsenic(As)砷Arsine(AsH)ASHER一种干法刻蚀方式Asher：去胶机ASI光阻去除后检查ASIC特定用途集成电路Aspectration：形貌比（ETCH中的深度、宽度比）ATE自动检测设备Backend：后段（CONTACT以后、PCM测试前）BacksideEtch背面蚀刻Backside晶片背面Baseline：标准流程Beam-Current电子束电流Benchmark：基准BGAballgridarray高脚封装Bipolar：双极Boat：扩散用（石英）舟Cassette装晶片的晶舟CD：criticaldimension关键性尺寸，临界尺寸Chamber反应室Chart图表Childlot子批chiller制冷机Chip(die)晶粒Chip：碎片或芯片。clamp夹子CMP化学机械研磨Coater光阻覆盖（机台）Coating涂布，光阻覆盖Computer-aideddesign（CAD）：计算机辅助设计。ContactHole接触窗ControlWafer控片Correlation：相关性。Cp：工艺能力，详见processcapability。Criticallayer重要层CVD化学气相淀积Cycletime生产周期Defectdensity：缺陷密度。单位面积内的缺陷数。Defect缺陷DEPdeposit淀积Depthoffocus（DOF）：焦深。Descum预处理Developer显影液；显影（机台）developer：Ⅰ）显影设备；Ⅱ）显影液Development显影DGdualgate双门DIfilter离子交换器DIwater去离子水Diffusion扩散disk靶盘disk/flagfaraday束流测量器Doping掺杂Dose剂量Downgrade降级DRCdesignrulecheck设计规则检查DryClean干洗Duedate交期Dummywafer挡片E/Retchrate蚀刻速率EE设备工程师ELSextendedlifesource高寿命离子源enclosure外壳页眉内容2页脚内容BPSG含有硼磷的硅玻璃Break中断，stepper机台内中途停止键cassette晶片盒EndPoint蚀刻终点e-shower中性化电子子发生器ETetch蚀刻Exhaust排气（将管路中的空气排除）Exposure曝光extrantionelectrode高压吸极FAB工厂fab：常指半导体生产的制造工厂。FIBfocusedionbeam聚焦离子束FieldOxide场氧化层filament灯丝film：薄膜，圆片上的一层或多层迭加的物质。flataligener平边检测器flat：平边flatbandcapacitanse：平带电容flatbandvoltage：平带电压Flatness平坦度flowcoefficicent：流动系数flowvelocity：流速计flowvolume：流量计flux：单位时间内流过给定面积的颗粒数Focus焦距forbiddenenergygap：禁带Foundry代工four-pointprobe：四点探针台FSG含有氟的硅玻璃functionalarea：功能区Furnace炉管gateoxide：栅氧glasstransitiontemperature：玻璃态转换温度GOIgateoxideintegrity门氧化层完整性gowning：净化服grayarea：灰区gyrodrive两方向偏转hardbake：后烘，坚烘,softbake(软烘)HCIhotcarrierinjection热载流子注入HDP：highdensityplasma高密度等离子体heatexchange热交换机High-Voltage高压host：主机Hotbake烘烤ICPinductivecoupleplasma感应等离子体ID辨认，鉴定IGBT绝缘门双极晶体管images：去掉图形区域的版implant注入Implant植入impurityn掺杂impurity：杂质inductivecoupledplasma(ICP)：感应等离子体inertgas：惰性气体initialoxide：一氧insulator：绝缘isolatedline：隔离线junction结junctionspikingn铝穿刺kerf划片槽landingpadnPADLayer层次LDDlightlydopeddrain轻掺杂漏linerdrive直线往复运动lithographyn制版loadlockvalve靶盘腔装片阀Localdefocus局部失焦因机台或晶片造成之脏污LOCOSlocaloxidationofsilicon局部氧化L...
