PCB基板厚度(包括芯板及半固化片)汇总VIP免费

PCB板材厚度规格：0.5mm,0.7mm,0.8mm,1.0mm,1.2mm,1.5mm,1.6mm,2.0mm,2.4mm,3.2mm,6.4mmPCB板上铜箔的厚度规格：18um,25um,35um,70um和105um常即半固叱片逐權r~r~板厚一般分为含铜和不含铜两种厚度一.含铜厚度:不含铜厚度L(W121161.2116A2L16111500762KI.762WA7WH7&2SMmil344.55773y.3E配料am配科陆恂(UIVIIIXIU6u1/16X7&2H0-21J11X21.1=6IL'117X762HH/ldXf刚j/j7X7WBH/HIX15063J/l”加期ITT1比押却li/ll7X7fr；agIXNK2/27X7624g.1M.I5D&1£1/iIXWKHilfi/i2X2116T/rEl/iis>ji62/1KXT&2HHZB1AViSX.762I1I/fH/HSX762H(U2/1lriHUTiminsu1.71/2SX762W1/1l!伽H托到十JDADUH2x托邛UJI9X762Mr/r2XTO4SH/H«LS切yz9X7&2JJl/l7*2Ss+LaWh-76i2ii1AgxTf曰WII762Ki-IDl^762San*JX762M览丁礎齢|1：懈屏丁石斯X9>：7«Bi/l1AVI1OX162Sli.]|^■X7fi2HlE^IIIUXlft2BJk7也JX762H-2/2lOXT^ZS1/1nift*2■7621+31162J>inI0XM話fl?llll/llOIUWHNK托2H+HJHUUi/il|X%2K1/14x?fiaH/HI2XT62EH.'H3I2X762E叩址4x?6；B2JHII3X762S1/11-"朋+ICXM床5沁轴ll/llfl/ll2K762S^2I[(I4-2-九S1/2lix^sIJU1C2^X7-62s+ll!6+2X7ifi2&2JmJIXTftlS1JI5X7fi±fi.JI.1L13X762^H/H5K76IH2G|3X?«SLt2/2X51?)JJX7<*2B1/15X州列IV1II3X762B11.112/2I6X762KLZXAK7618剂1HIfrXW^tVIAX762HH/11I&XT62Snil1/1L7<7t2K込l7X7ft2R厚a配斛怙构20a.Q5&ixioe柿脅20工甜折*Q.刖ao?&1；1X1O3O£；吉MF编跻呢科詩构4aEba10E1：;1X2116抚或2X1M谏1K2113K1K2M3蜕丄DSd+1曲Ea由」.：1X2116itiJXlOEO6&.15（T0i]G2l.jiMSoeiitiixiosoT0.1788G2Q0飞2昭I'ElX^Ze1^:2x2116^2X21L3g0.22852X211610CL25*2阴2X^IIB11也280l.ilfleO+2Ll&*l[Htlri；!2X1J6511H.3'63S；^[2115+2MTtQMElU2E□64W0.651060*3X762E+10S132?1030rjx7^26*103028o.iro.in1：4>.<628肉：•|X：62E3031OLTWP时1foot=12inch=304.8mmlinch=25.4mm1mil=0.0254mm1inch=1000mil1OZ=28.375g1OZ铜箔其真正厚度为1.38mil或35pm一、芯板、半固化片规格：1.生益芯板常见规格：0.1mm（含铜厚）0.2mm〜5.120.3mm〜9.060.4mm〜12.990.5mm〜16.930.6mm〜20.870.7mm〜24.80.8mm〜28.740.9mm〜36.611mm〜44.491.2mm~52.361.5mm~56.31.6mm~60.242mm~75.982.4mm〜91.732.半固化片：1080〜3.0mil2116~4.2mil7628〜7.0mil3.流胶厚：1080〜2.5mil7628〜6.5mil0.14mm=2*10800.21mm=2*21160.24mm=7628+10800.36mm=2*76280.4mm=2*7628+1080二、常用半固化片在不同铜厚、不同图形厚度变化：1.Ctipper/gniiGnd/^ndCopper/signalGnil/si«：nalSi^nal/si^njl7628737.06.K6.76.6lilt4.64.44.24.03.833133.S3.73丹3J10802.S2.6152.42.27628H7.67.37J7.06.92U6H4.94.74.5434.133BH4」4.0艮73.5I018H2,92.72,62.52.37628C7.16.86.66.56.433I3C3再3.63J3.23.12.Ct-ipper/gmiGnd/gndCopper/si£：nalGnil/sign^lSignal/sigiuJ762S7J氐呂&66.56.421164.54.34.13.93.73313xs3.73.63*43.2I0S02.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.2斗.03313H4.03.93.8玉&3.4I01SH2.92.72.fi2.5237628C6.96.66.4636.23313C3.6153.43,23.03.规树脂含量压合厚度ni/±20HI压合障度Mil10671±3512.0土641080L61±3722.8+0.41OSOA64±3803.1±0.41O8OH68±3923-6±0.42116L50土？US4.5±0.62116A52±31214.8±0.62116H56±313553±0.63313占5土31024.0±0.67628L41±31887.4±0.87628A43±31987.8±0.87628M46±32138.4+0.87628H50±32359.310.81S06A4S±31626.4±0.81506H48±31756.9±0.8树脂含H压合暉度a/±20ia压合障度Mil10671±3502.0±0*41080L61±3712.8f0.41080A64±378|3.1±0.41080H68±3903(5±0.42116L50±31134.4tO-62116A52±31204.7+0.62116H56±313315.2±0.6331355±31004.0±0.67628L41±31857.3±0.8762SA43+319517/7土687628M46±32108.3+0.87628H50±32309.1±0.81S06A45±3160n6,3±0.81506H49±31756.9±0.8树脂含簞压合厚度p皿/土二0#m压合障度Mil10671±3191(9±0.41080L62±3722.8+0.41080A65土3793.1±0.41080H68土388£6土0■斗2116L51±31144.5+0.62116A53±31204.7±0.62116H56±31305.1±0.6331356±31004.0±0.67628L42±31877.4+0.87628A44±31957,7土0.87628M46±32058.1±0.87628H50-32278.9±0.81S06A45131566.1±0.81506H48±31686.6±0.8树階含量压合暉度压合障度JH/±20mMil10671±3171,9±0*41080L63±3712.8+0.41080A66±3783A+0.41OSOH68土38333土642116L碇土31124.4±0.62116A55±31214.8±0.62116H58±31325-2±0.6331355±3943.7±0.67628L43±31857.3±0.87628A46土319B7.8±0.87628M48±32078.1±0.87628H50±32188.6±0.81S06A45±31S15.9+0.81506H48±31626.4±0.8