Q/DKBA 华为技术有限公司企业技术标准Q/DKBA3178.2-2004代替 Q/DKBA3178.2-2003高密度 PCB（HDI）检验标准 2004 年 11 月 16 日发布 2004 年 12 月 01 日实施 华 为 技 术 有 限 公 司Huawei Technologies Co., Ltd.版权所有 侵权必究All rights reserved目 次前 言..............................................................41范围...............................................................61.1范围.........................................................61.2简介.........................................................61.3关键词.......................................................62规范性引用文件.....................................................63术语和定义.........................................................64文件优先顺序.......................................................75材料要求...........................................................75.1板材.........................................................75.2铜箔.........................................................85.3金属镀层.....................................................86尺寸要求...........................................................86.1板材厚度要求及公差...........................................86.1.1 芯层厚度要求及公差......................................86.1.2 积层厚度要求及公差......................................86.2导线公差.....................................................86.3孔径公差.....................................................86.4微孔孔位.....................................................97结构完整性要求.....................................................97.1镀层完整性...................................................97.2介质完整性...................................................97.3微孔形貌.....................................................97.4积层被蚀厚度要求............................................107.5埋孔塞孔要求................................................108其他测试要求......................................................108....
