SMT 常用术语&中英文对照 微組裝技術﹕MPT/Microelectronic Packaging echnology 混裝技術﹕Mixed Component Mounting Technology 封裝﹕ Package 貼片﹕ Pick and Place 拆焊﹕ Desoldering 再流﹕Reflow 浸焊﹕ Dip Soldering 拖焊﹕ Drag soldering 印制電路﹕Printed Circuit 印制線路﹕ Printed Wiring 印制電路板﹕ printed circuit board 印制線路板﹕printed wiring board 層壓板﹕laminate 覆铜銅薄层壓板﹕copper-clad laminate 基材﹕base material 成品板﹕production board 印刷﹕printing 導電圖形﹕conductive pattern 印制元件﹕printed component 單面印制板﹕single-sided printed board 雙面印制板﹕double-sided printed board 多層印制板﹕multilayer printed board 電烙鐵﹕ Iron 熱風嘴﹕ hot air reflowing noozle 吸錫帶﹕soldering wick 吸錫器﹕tin extractor 焊後檢驗﹕post-soldering inspection 目視檢驗﹕visual inspection 機器檢驗﹕ machine inspection 焊點質量﹕ soldering joint quality 焊電缺陷﹕ soldering jont defect 錯焊﹕ solder wrong 漏焊﹕ solder skips 虛焊﹕ pseudo soldering 冷焊﹕ cold soldering 橋焊﹕ solder bridge 脫焊﹕ open soldering 焊點剝離﹕ solder off 不潤濕焊點﹕ soldering nonwetting 錫珠﹕ solder ball 拉尖﹕ icicle ； solder projection 孔洞﹕ void 焊料爬越﹕ solder wicking 過熱焊點﹕ overheated solder connection 不飽和焊點﹕ insufficient solder connection 過量焊點﹕ excess solder connection 助焊劑剩余﹕ flux residue 焊料裂紋﹕ solder crazeing 焊角翹起﹕ fillet-lifting ；lift-off AI :Auto-Insertion 自動插件 AQL :acceptable quality level 允收水準 ATE :automatic test equipment 自動測試 ATM :atmosphere 氣壓 BGA :ball grid array 球形矩陣 CCD :charge coupled device 監視連接元件(攝影機) CLCC :Ceramic leadless chip carrier 陶瓷引腳載具 COB :chip-on-board 晶片直接貼附在電路板上 cps :centipoises(黏度單位) 百分之一 CSB :chip scale ball grid array 晶片尺寸 BGA CSP :chip scale package 晶片尺寸構裝 CTE :coe...
