1.TDP--Thermal Design Power 散热设计功耗 2.SMBu s ---System Management Bus 系统总线 3.GPIO---General Purpose Input Output 通用输入/输出或总线扩展器 4.SIO--超级输入输出芯片 5.SO-DIMM--小外形双列内存模组 6.DIMM--Dual-Inline-Memory-Modules,即双列直插式存储模块 7.SPI--Serial Peripheral Interface--串行外设接口 8.IDE--微型计算机智能接口，是现在普遍使用的外部接口，主要接硬盘和光驱，传输模式有以下三种：PIO(Programmed I/O)模式、DMA(Driect Memory Access)模式、Ultra DMA(简称UDMA)模式 9.AMT---主动管理技术 10.POST--通电自检程序 11.HDMI--High Definition Multimedia Interface 高清晰度多媒体接口 12.CRT ---Cathode Ray Tube 阴极射线管 13.DAC --Digital Analog Converter 数模转换器 14.DDC --Display Data Channel—I2C bus interface between a display and a graphics adapter. 显示数据通道 15.DVI --Digital Visual Interface —video interface standard developed by the Digital Display Working Group (DDWG). 数字可视化界面 16.EFT --Electrical Fast Transient 电快速瞬变 17.EMI --Electro magnetic Interference 电磁干扰 18.ESD --Electrostatic Discharge 静电放电 19.ExpressCard --A PCMCIA standard built on the latest USB 2.0 and PCI Express buses. 20.GBE --Gigabit Ethernet 千兆以太网 21.LPC-- Low Pin-Count Interface: a low speed interface used for peripheral circuits such as Super I/O controllers, which typically combine legacy-device support into a single IC. 低针脚数接口 22.LVDS --Low-Voltage Differential Signaling 低压差分信号 23.PCI Express (PCIe)-- Peripheral Component Interface Express – next-generation high speed Serialized I/O bus 24.PCI Express Lane --One PCI Express Lane is a set of 4 signals that contains two differential lines for Transmitter and two differential lines for Receiver. Clocking information is embedded into the data stream. 25.SATA --Serial ATA attachment: serial-interface standard for ha...
