最全的芯片封装方式大全 各种 IC封装形式图片 BGA Ball Grid Array EBGA 680L LBGA 160L PBGA 217L Plastic Ball Grid Array SBGA 192L QFP Quad Flat Package TQFP 100L SBGA SC-70 5L SDIP SIP Single Inline Package SO Small Outline Package TSBGA 680L CLCC CNR Communication and Networking Riser Specification Revision 1
2 CPGA Ceramic Pin Grid Array DIP Du al In lin e Package SOJ 32L SOJ SOP EIAJ TYPE II 14L SOT220 SSOP 16L SSOP TO18 DIP-tab Dual Inline Package w ith Metal Heatsink FBGA FDIP FTO220 Flat Pack HSOP28 ITO220 TO220 TO247 TO264 TO3 TO5 TO52 TO71 ITO3p JLCC LCC LDCC LGA LQFP PCDIP PGA Plastic Pin Grid Array TO72 TO78 TO8 TO92 TO93 TO99 TSOP Thin Small Outline Package PLCC 详细规格 PQFP PSDIP LQFP 100L 详细规格 METAL QUAD 100L 详细规格 PQFP 100L 详细规格 QFP Quad Flat Package TSSOP or TSOP II Thin Shrink Ou tline Package uBGA