精品文档---下载后可任意编辑目录第 2 章 半导体芯片制造工艺与设备.......................................................................12.1 概述.....................................................................................................12.2 薄膜生成工艺.........................................................................................52.2.1 薄膜生成方法................................................................................52.2.2 氧化工艺......................................................................................62.2.3 淀积工艺......................................................................................72.3 图形转移工艺.......................................................................................102.3.1 图形化工艺方法............................................................................102.3.2 光刻工艺.....................................................................................112.3.3 刻蚀工艺....................................................................................162.4 参杂工艺.............................................................................................172.4.1 扩散...........................................................................................172.4.2 离子注入.....................................................................................182.5 其他辅助工艺.......................................................................................192.5.1 热处理工艺..................................................................................192.5.2 清洗工艺.....................................................................................212.5.3 CMP.........................................................................................222.6 半导体芯片制造工艺设备........................................................................232.6.1 半导体芯片制造工艺设备分类.........................................................232.6.2 半导...
