常见封装形式简介DIP=HDIP=直插封装SDIPSIPHSIP 封装SOPHSOP装 eSOPDualDualShrinkSingleSingleSmallSmallSmallInlinePackage=双列直插封装InlinePackagewithHeatSink=带散热片的双列DualInlinePackageInlinePackage=InlinePackagewith=紧缩型双列直插封装单列直插封装HeatSink=带散热片的单列直插OutlinePackageOutlinePackagewithHeatSink=小外形封装带散热片的小外形封Outline Packagewithexposedthermalpad=载体外露于塑封体的小外形封装SSOPTSSOPTQPFPQFPLQPFeLQPFpadDFNQFNTOSOTBGABQFPCADCBGACCGACSPDFPDSO3D2DFCBICI/OLSIMBGAMCMMCPMEMSMFPShrinkSmallThinShrinkThinProfilePlasticQuadOutlinePackage=紧缩型小外形封装SmallOutlinePackage=薄体紧缩型小外形封装QuadFlatPackage=薄型四边引脚扁平封装FlatPackage=方形扁平封装=薄型方形扁平封装LowProfileQuadPackageLowProfileQuadFlatPackagewithexposedthermal 载体外露于塑封体的薄型方形扁平封装 DualFlatNon-leadedQuadFlatNon-leadedTransistorpackageSmallOutlineofBallGridArray=QuadFlatPackageWithBumperComputerAidedDesign=CeramicBallGridArray=CeramicColumnGridChipSizePackageDualFlatPackageDualSmallOutlineThree-DimensionalTwo-DimensionalFlipChipBondingIntegratedCircuitInput/OutputPackage=双面无引脚扁平封装Package=双面无引脚扁平封装=晶体管封装Transistor球栅阵列封装=带缓冲垫的四边引脚扁平封装计算机辅助设计陶瓷焊球阵列陶瓷焊柱阵列小外形晶体管Array芯片尺寸封装双侧引脚扁平封装双侧引脚小外形封装三维二维倒装焊集成电路输入/输出Circuit=大规模集成电路金属基板 BGA 多芯片组件多芯片封装微电子机械系统LargeScaleIntegratedMetalBGA=MultichipModule=MultichipPackage=MicroelectroMechanicalSystemMiniFlatPackage=微型扁平封装常用文件、表单、报表中英文名称清除通知单工程变更申请持续改善计划戴尔专案收据数据表核对表文件清单设备清单调查表，问卷报名表追踪记录表日报表周报表月报表年报表年度报表财务报表品质报表生产报表不良分析报表首件检查报告初步报告（或预备报告）一份更新报告一份总结报告纠正与改善措施报告（异常报告单）出货检验报告符合性报告（材质一致性证明）稽核报告品质稽核报告PurgenoticeECR(EngineeringChangeRequest)CIP(continuousimprovementplan)DellProjectReceiptDatasheetChecklistDocumentationchec...
