AEC-Q100-Rev-HSePtemberlIq2014FAILUREMECHANISMBASEDSTRESSTESTQUALIFICATIONFORINTEGRATEDCIRCUITSAutomotiveElectronicsCouncil^—^≡-^^―ComponentTechnicalCommitteeAEC-QIOO-REV-HSePtember11,2014AutomotiveElectronicsCouncilComponentTechnicalCommitteeTABLEOFCONTENTSAEC-QlOOFailureMechanismBasedStressTestQualificationforIntegratedCircuitsAppendix1:DefinitionofaQualificationFamilyAppendix2:Q100CertificationofDesign,ConstructionandQualificationAppendix3:PlasticPackageOpeningforWireBondTestingAppendix4:MinimumRequirementsforQualificationPlansandResultsAppendix5:PartDesignCriteriatoDetermineNeedforEMCTestingAppendix6:PartDesignCriteriatoDetermineNeedforSERTestingAPPendiX7AEeQIOOandthnUSSOfMiSSiOoProfileSAttachmentsAEC-Q100-001:WIREBONDSHEARTESTAEC-Q100-002:HUMANBODYMODEL(HBM)ELECTROSTATICDISCHARGE(ESD)