ISO 26262-11-2018原版完整文件VIP免费

©ISO2018INTERNATIONALSTANDARDISO26262-11Firstedition2018-12Roadvehicles—Functionalsafety—Part11:GuidelinesonapplicationofISO26262tosemiconductorsVéhiculesroutiers—Sécuritéfonctionnelle—Partie11:Lignesdirectricessurl'applicationdel'ISO26262auxsemi-conducteursReferencenumberISO26262-11:2018(E)ISO26262-11:2018(E)ii©ISO2018–Allrightsreserved©ISO2018COPYRIGHTPROTECTEDDOCUMENTAllrightsreserved.Unlessotherwisespecified,orrequiredinthecontextofitsimplementation,nopartofthispublicationmaybereproducedorutilizedotherwiseinanyformorbyanymeans,electronicormechanical,includingphotocopying,orpostingontheinternetoranintranet,withoutpriorwrittenpermission.PermissioncanberequestedfromeitherISOattheaddressbeloworISO’smemberbodyinthecountryoftherequester.ISOcopyrightofficeCP401•Ch.deBlandonnet8CH-1214Vernier,GenevaPhone:+41227490111Fax:+41227490947Email:copyright@iso.orgWebsite:www.iso.orgPublishedinSwitzerlandiii©ISO2018–AllrightsreservedISO26262-11:2018(E)ContentsPageForeword.........................................................................................................................................................................vIntroduction..................................................................................................................................................................vi1Scope....................................................................................................................................................................12Normativereferences....................................................................................................................................13Termsanddefinitions...........................................................................................................................14Asemiconductorcomponentanditspartitioning....................................................................................24.1Howtoconsidersemiconductorcomponents...............................................................................................24.1.1Semiconductorcomponentdevelopment......................................................................................24.2Dividingasemiconductorcomponentinparts..............................................................................................24.3Abouthardwarefaults,errorsandfailuremodes.........................................................................34.3.1Faultmodels............................................................................................................................................34.3.2Failuremodes.........................................................................................................................................44.3.3Thedistributionofbasefailurerateacrossfailuremodes........................................................44.4Aboutadaptingasemiconductorcomponentsafetyanalysistosystemlevel...............................54.5IntellectualProperty(IP)..............................................................................................................64.5.1AboutIP.....................................................................................................................................................64.5.2CategoryandsafetyrequirementsforIP..............................