IGBT导热硅脂的涂抹及表面粗糙度要求

Thermal grease forInfineon modulesWhat should be the behavior and how agrease has to look likeBaginskiIFAG AIM PMD ID AE2025-06—01ConsiderationsInfineon modules with baseplate： Roughness of baseplateRZmax. = 16 µm;RZtyp。 = 4 – 6 µmInfineon modules without baseplate： Roughness of ceramicRZmax. = 9 µm; RZtyp。 = 3 – 4 µmHeatsink： Specification of roughness regarding Application NoteModules with and without baseplate： RZmax。 = 10 µmThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication， including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ。 The recipient of this presentation must verify any function described herein in the realapplication。 Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation。6-Mar-08BaginskiCopyright © Infineon Technologies 2025。 All rights reserved.Page 2ConsiderationsExample of roughness of baseplate and heatsinkBaseplateRZtyp。 = 6 µmRZmax. = 10 µmHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infi...