I课题名称电路板回流焊机温度控制的研究摘要回流炉是表面焊接工艺中的重要焊接设备。它提高了钎料的熔点温度，然后把芯片块在PCB钎焊盘，确保PCB和组件之间的电连接。在工作时，必须确保按照焊接元件的标准温度曲线控制温度变化的波动线路。控制温度变化波动线路的标准是保证上下班的加热效果和温度变化的稳定。稳定性是保证产品质量的关键。随着超大功率范围的微型集成电路和计算技术的不断进步,出现了一种将被称为微的单片式电机微型化的计算机。由于其产品结构简单体积小,功能强大以及超高的性价比,单片机被广泛用于温度控制。使用单片机作为主控制模块,无触点控制,可以满足温度的收集和调节要求。因此,它广泛地应用在电子仪表、家庭电器、节约能源设备等各个方面。机器人的技术、企业过程管理和控制,不仅有助于改善产品的功能和质量,而且有助于提高生产率。本文主要介绍单片机对回流焊接电路板的温度管理中所采取的方法。详细介绍了温度控制模块的组成和所选择的主要设备工具。关键词：单片机；温度控制；回流焊机。IIAbstractTherefluxfurnaceisanimportantweldingequipmentinthesurfaceweldingprocess.whichraisesthemeltingpointtemperatureofthesolderandthenputsthechipblockonthePCBbrazingpadtoensuretheelectricalconnectionbetweenthePCBandtheassembly.Whenworking,ensurethatthefluctuationlineoftemperaturechangeiscontrolledaccordingtothestandardtemperaturecurveofweldingelement.Thestandardtocontrolthefluctuationlineoftemperaturechangeistoensuretheheatingeffectandthestabilityoftemperaturechange.Stabilityisthekeytoensureproductquality.Withthecontinuousprogressofmicro-integratedcircuitsandcomputingtechnologyinsuper-largepowerrange,akindofmicrocomputerwhichwillbecalledmicromonolithicmotorhasemerged.Becauseitsproductstructureissimpleandsmall,powerfulandsuper-highperformance-priceratio,single-chipmicrocomputeriswidelyusedintemperaturecontrol.Usingsinglechipmicrocomputerasthemaincontrolmodule,contactlesscontrolcanmeettherequirementsoftemperaturecollectionandregulation.Therefore,itiswidelyusedinelectronicinstruments,homeappliances,energysavingequipmentandotheraspects.Robottechnology,enterpriseprocessmanagementandcontrol,notonlyhelptoimprovethefunctionandqualityofproducts,butalsohelptoimproveproductivity.Thispapermainlyintroducesthemethodoftemperaturemanagementofrefluxweldingcircuitboardbysinglechipmicrocomputer.Thecompositionofthetemperaturecontrolmoduleandthemainequipmenttoolsselectedareintroducedindetail.Keyword：SCM；Temperaturecontrol；Reflowwelder.1目录1绪论......................................................................................................................1.1引言............................................................................................................1.2回流焊简介..............................................................................................11.3研究现状..................................................................................................21.4研究意义..................................................................................................32系统总体方案的设计与实现............................................................................42.1无铅回流焊接..........................................................................................42.2电路板回流焊机控制系统........................................................................2.3方案选择设计..........................................................................................62.3.1系统设计要求...................................
