基于单片机的超声波测厚仪设计 计算机科学和技术专业VIP免费

I课题基于单片机的超声波测厚仪设计摘要超声波技术具有可以快速准确地测量金属和非金属材料的厚度且无污染的优点，所以非常适用于复合材料、非金属、金属等多种材料制件的无损评价。其穿透能力强的特点，可检测较大厚度范围的试件内部，也可扫查整个试件体积；特别是如果只可以通过单面接触，更能显示其优点。本文设计了一种超声波测厚仪，它由AT89C51单片机、HC-SR04超声波传感器、LM016L液晶显示屏、DS18B20温度传感器等部分组成。基于原始超声波厚度测量，该设计考虑到温度变化可能引起的误差，采用了温度补偿的方法。使用液晶显示画面显示厚度，若超过规定厚度范围则发出警告。关键词：超声波测厚；AT89C51；温度补偿。IIAbstractUltrasonictechnologycanquicklyandaccuratelymeasurethethicknessofmetalandnon-metalmaterialsandpollution-free,soitisverysuitablefornondestructiveevaluationofcompositematerials,non-metal,metalandothermaterials.Itshighpenetrationcapabilityenablesdetectionoftheinteriorofaspecimenoverawiderangeofthickness,aswellasscanningoftheentirespecimenvolume,especiallyifonlyonesideofthespecimencanbeaccessed.Thispaperdesignsanultrasonicthicknessmeasuringinstrument,whichiscomposedofAT89C51microcontroller,HC-SR04ultrasonicsensor,LM016Lliquidcrystaldisplay,DS18B20temperaturesensorandsoon.Basedontheoriginalultrasonicthicknessmeasurement,thedesigntakesintoaccounttheerrorcausedbythetemperaturechangeandadoptsthetemperaturecompensationmethod.UseLCDscreentodisplaythethickness.Ifthethicknessexceedsthespecifiedrange,awarningwillbeissued.Keywords:ultrasonicthicknessmeasurement;AT89C51;temperaturecompensation.III目录第一章绪论...............................................................................................................................-1-1.1课题研究背景意义........................................................................................................-1-1.2超声波测厚仪的发展....................................................................................................-1-1.3本文结构安排................................................................................................................-2-第二章超声波测厚的基本原理...............................................................................................-3-2.1超声波的介绍................................................................................................................-3-2.2超声波侧厚仪的原理....................................................................................................-4-2.3设计思路........................................................................................................................-6-2.4本章小结........................................................................................................................-7-第三章硬件设计.......................................................................................................................-8-3.1单片机模块....................................................................................................................-8-3.2温度检测模块..............................................................................................................-11-3.3超声波模块..................................................................................................................-13-3.4蜂鸣器和指示灯报警电路..........................................................................................-14-3.5显示模块......................