PCB基板厚度包括芯板及半固化片PERSONALRESUMEPCB板材厚度规格:??????????PCB板上铜箔的厚度规格:18um,25um,35um,70um和105um常用半固化片规格：型号10802116L2116A2116H15007628L7628A7628H7628M厚mil345678板厚一般分为含铜和不含铜两种厚度一．含铜厚度：规格配料结构规格配料结构H/H1X1061/16X76281/11X2116H/H7X7628H/12X10802/27X7628H/H1X15061/17X7628T/T1X7628H/H7X76282/21X1062/27X76282/21X15061/18X7628H/21X7628H/H8X76281/12X2116T/T8X7628H/12X21162/28X7628H/H1080+2116+10801/18X7628T/T1080+2116+1080H/H8X76282/21080+2116+10802/28X76281/11080+7628+1080H/H2X76281/19X7628T/T2X7628H/H9X76282/22X76282/29X76281/17628+1080+76281/19X7628H/H7628+1080+7628H/H9X76282/27628+1080+76282/29X76281/13X76281/110X7628H/H3X7628H/H10X76282/23X76282/210X76281/12116+2X7628+21161/110X7628H/H1080+3X7628+1080H/H11X76282/21080+3X7628+10801/111X76281/14X7628H/H12X7628H/H4X76282/212X76282/24X76281/112X76281/12X7628+1080+2X7628H/H12X7628H/H2X7628+2116+2X76282/212X76282/22X7628+2116+2X76281/113X76281/15X7628H/H13X7628H/H5X76282/213X76282/25X76281/113X76281/15X7628H/H13X7628H/H6X76282/216X76282/26X76281/116X76281/16X7628H/H16X7628H/H6X76281/117X76282/217X7628．不含铜厚度厚度mil厚度mm配料结构备注21X106不含20Z铜箔3主：1X1080次：1X1086不含2OZ铜箔厚度mil厚度mm配料结构备注4主：1X2116次：1X3313或2X106或1X2113或1X2313或1080+1065主：1X2116次：2X10806主：1X1506次：2X10807主：1X7628次：1080+21168主：1X7628次：2X2116或2X211392X2116102X211611主：1080+2116+1080次：2X216512主：2X1506次：2116+1080+211613主：1080+7628+1080次：2X1506142X7628152X762816主：2X7628次：3X211617主：7628+1080+7628次：2X7628187628+1080+7628197628+2116+762820主：7628+2116+7628次：7628+2X1080+7628或3X7628213X7628223X7628233X762824主：3X7628次：2116+2X7628+211625主：3X7628次：2116+2X7628+2116261080+3X7628+1080271080+3X7628+108028主：4X7628次：4X7628304X7628314X7628友情备注：1foot=12inch=mm1inch=mm1mil=mm1inch=1000mil1OZ=1OZ铜箔其真正厚度为或35口m一、芯板、半固化片规格1．生益芯板常见规格：（含铜厚）1mm~2mm~2．半固化片：1080~2116~7628~3．流胶厚：1080~7628~=2*1080=2*2116=7628+1080=2*7628=2*7628+1080二、常用半固化片在不同铜厚、不同图形厚度变化1．HOZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76282116331310807628H2116H3313H1018H762833132．1OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76282116331310807628H2116H3313H1018H7628C3313C3．2OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76282116331310807628H2116H3313H1018H7628C3313C4．3OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76282116331310807628H2116H3313H1018H7628C3313C注：Gnd为65%以上的大铜箔，H为高树脂含量，C为低树脂含量。S0401粘结片压合厚度（100%残铜率）指标树脂含量压合厚度um/±20um压合厚度Mil10671±350±1080L61±371±1080A64±378±1080H68±390±2116L50±3113±2116A52±3120±2116H56±3133±331355±3100±7628L41±3185±7628A43±3195±7628M46±3210±7628H50±3230±1506A45±3160±1506H49±3175±S0701粘结片压合厚度（残铜率100%）指标树脂含量压合厚度um/±20um压合厚度Mil10671±351±1080L61±372±1080A64±380±1080H68±392±2116L50±3115±2116A52±3121±2116H56±3135±331355±3102±7628L41±3188±7628A43±3198±7628M46±3213±7628H50±3235±1506A45±3162±1506H48±3175±S1000B粘结片压合厚度（残铜率100%）指标树脂含量压合厚度um/±20um压合厚度Mil10671±347±1080L63±371±1080A66±378±1080H68±383±2116L52±3112±2116A55±3121±2116H58±3132±331355±394±7628L43±3185±7628A46±3198±7628M48±3207±7628H50±3218±1506A45±3151±1506H48±3162±S0155粘结片压合厚度（100%残铜率）指标树脂含量压合厚度um/±20um压合厚度Mil10671±349±1080L62±372±1080A65±379±1080H68±388±2116L51±3114±2116A53±3120±2116H56±3130±331356±3100±7628L42±3187±7628A44±3196±7628M46±3205±7628H50±3227±1506A45±3156±1506H48±3168±
