Page:1FPCFPCLAYOUT技術手冊Page:2FPC1.FPC产品系列应用介绍1.1NOTEBOOK…………………………1.2LCDPANEL1.3PDA1.4CELLULARPHONE2.原材料介紹2.1铜箔2.2Coverlay2.3Stiffener2.4相关测试规范3.FPC标准制程流程介绍3.1单面板/双面板3.2单面板双层做法3.3缕空板4.制程能力介绍目录Page:3FPCApplicationForNootbookHingeCableDouble-sidedFPCImpedance50560,000CyclesFlexureLifeEMIStrategyApplicationHingeCableDouble-sidedFPCImpedance50560,000CyclesFlexureLifeCardbusDouble-sidedFPC100MHzTransferSpeedTouchPadDouble-sidedFPCSMTMountingPage:4FPCApplicationForNootbook–CD/DVDROMDouble-sidedFPCStandardIDEInterfaceGroundingStrategyApplicationSingle-sidedFPCSpindleControlUnitSwitch&PhotoSensorAppliedonFPCSingle-sidedFPC60,000CyclesFlexureLifeUltraThinMaterialDesignPage:5FPCApplicationForLcdPanelLCMCableDouble-sidedFPCSMCMountingEMINoiseDepressionLCMCableDouble-sidedFPCSMCMountingACFLaminatingonFPCLCMCableDouble-sidedFPCFinePattern(L/S=1.6/1.8mil)ACFLaminatingonFPCPage:6FPCApplicationForPDASwitchBoardDouble-sidedFPCSMTMountingBatteryBoardSingle-sidedFPCSMCMountingHighCurrent-carriyngCapacityPage:7FPCApplicationForCELLULARPHONEDouble-sidedFPC100,000CyclesFlexureLifeACFLaminatingonFPCDouble-sidedFPCBatteryPage:8FPCRawMaterial-CCL相關名詞:•CopperCladLaminates(銅薄基材)•Single-Sided(單面銅薄基材)•Double-Sided(雙面銅薄基材)CopperFoil:銅箔，銅皮RA銅:壓延銅箔,輾壓方式。ED銅:電解銅箔,電鍍方式(Electrodeposited)。一盎司:即在一平方英呎的面積上，長出一盎司的銅。Polyimide(PI)聚亞醯胺:是一種由Bismaleimide與AromaticDiamine所共同聚合而成的優良樹脂,杜邦公司將之做成片材，稱為Ketpon。AdhesiveConductorDielectricSubstrateAdhesiveConductorDielectricSubstratePage:9FPC•Coverlay(覆蓋膜):是由介質薄膜與背膠層所組成，用於動態軟板時，須注意軟板線路層與覆膜兩者之平衡。DielectricSubstrateAdhesiveMylarAdhesiveKaptonRawMaterial-CVLPage:10FPCCopperRollKaptonRollHeater1Heater2LiquidAdhesiveRawMaterialManufacturingProcessPage:11FPC•用途:•材質區分:PI/PET/FR4/SUS…•結合方式:PSA:感壓型ThermalSet:熱固型ThermalPlastic:熱塑型RawMaterial-STIFFENERPage:12FPCFPC材料所用的相关测试oIPC－TM650oJIS标准Page:13FPCFPC的可靠性测试•一、剥离强度•二、耐热性•三、可焊性•四、耐化学溶剂•五、弯曲疲劳Page:14FPCManufacturingProcessManufacturingProcessCoverlayAdhesiveCopperAdhesiveBaseFilmAdhesiveCopperAdhesiveCoverlay鑽孔NCDrilling鑽孔NCDrilling雙面板DoubleSided雙面板DoubleSided黑孔&鍍銅BlackHole&CuPlating黑孔&鍍銅BlackHole&CuPlatingCVL壓合CVLLaminationCVL壓合CVLLamination沖孔HolePunching沖孔HolePunching沖型Blanking沖型Blanking電測/目檢Elec.-test&VisualInspection電測/目檢Elec.-test&VisualInspection表面黏著/組裝SMT&Assembly表面黏著/組裝SMT&Assembly壓膜/曝光D/FLamination&Exposure壓膜/曝光D/FLamination&Exposure顯影/蝕刻/去膜D.E.S.顯影/蝕刻/去膜D.E.S.單面板SingleSided單面板SingleSided自動光學檢測AutomaticOpticalInspection自動光學檢測AutomaticOpticalInspection假貼合CVLLayup假貼合CVLLayup錫鉛電鍍/噴鍚Sn/PbPlatingorHAL錫鉛電鍍/噴鍚Sn/PbPlatingorHAL電測/目檢Elec.-test&VisualInspection電測/目檢Elec.-test&VisualInspection印刷ScreenPrinting印刷ScreenPrintingPage:15FPC制程能力介绍制程能力介绍•一、板厚–单面：•最小：0.068mm•普通：0.135mm–双面：•最小：0.16mm•普通：0.275mmCoverlayAdhesiveCopperAdhesiveBaseFilmAdhesiveCopperAdhesiveCoverlayBaseFilmAdhesiveCopperAdhesiveCoverlayPage:16FPC制程能力介绍制程能力介绍•二、最小线宽线距–单面：•1/2ozCu：0.05mm~0.05mm•1ozCu：0.075mm~0.075mm–双面：•1/3ozCu：0.05mm~0.05mm•1/2ozCu：0.075mm~0.075mmPage:17FPC制程能力介绍制程能力介绍•三、最小过孔–最小过孔：0.2mm–最小过孔焊盘：0.5mmØ2Page:18FPCl制程能力介绍制程能力介绍•四、线到板边最小距离–0.25mmPage:19FPCssss制程能力介绍制程能力介绍•五、焊盘开窗–最小单边比焊盘大0.1mm–焊盘开窗到邻近线的距离最小为0.1mmPage:20FPC制程能力介绍制程能力介绍•六、模具公差–刀模：±0.2mm–普通钢模：±0.1mm–精密钢模：±0.05mmPage:21FPCØØab制程能力介绍制程能力介绍•七、冲模最小冲孔–圆孔：Ø0.4mm–方孔：0.4mm×0.4mm–长方孔：0.3mm×0.6mmPage:22FPC制程能力介绍制程能力介绍•八、模具间隙最小0.4mm•九、模具搭边最小1mmcPage:23FPCTheEnd
