J-STD-033D处理，包装，运输和使用湿度，回流，和过程敏感设备VIP专享VIP免费

Downloaded by Harlan Jack (txsjd666@163.com) on Oct 20, 2023, 12:42 am PDTJOINT INDUSTRY STANDARD --IPC/JEDEC J STD033D 2018AprilSupersedes IPC/JEDEC J-STD-033C-1 August 2014Handling, Packing, Shipping and Use of Moisture,Reflow, and Process Sensitive DevicesDownloaded by Harlan Jack (txsjd666@163.com) on Oct 20, 2023, 12:42 am PDTDownloaded by Harlan Jack (txsjd666@163.com) on Oct 20, 2023, 12:42 am PDTNoticeJEDEC and IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domesticallyor internationally.Recommended Standards and Publications are adopted by JEDEC andIPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, JEDEC and IPC do not assume any liability to any patent owner, nor do they assume any obligation whateverto parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.The material in this joint standard was developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged De...