BGAprocessflowpresentationWhyassemblyofdice？为什么要封装芯片1.ELECTRICALINTERCONNECTION1.电连接2.MECHANICALSUPPORT/HANDLING/SOLDERING1.提供机械支持，便于处理及电焊3.PHYSICAL/CHEMICAL/RADIATIONPROTECTION1.防止物理/化学/辐射物损伤4.POWERDISSIPATION散热BGAprocessflowpresentationHowtoassemblethedice?如何封装芯片BGAPROCESSFLOWBGA生产流程WaferMountWaferSawDieAttachWireBondMoldingMarkingSolderballsPlacementSingulationTestingPackingBGAprocessflowpresentationWaferMounting贴片Operation:Tostickwaferonadhesivetape操作：将来料晶片粘贴在蓝膜上Aim:TosustainandholdthewaferduringSawingandDieAttach目的：在切片及粘片的工序中保持晶片和芯片稳固的位置BGAprocessflowpresentationWaferSawing切片Operation:Sawingofthewaferthroughthescribingstreets操作：沿切割道切割芯片Aim:Toseparatethedice目的：将晶片切割为芯片单元BGAprocessflowpresentationDieAttach粘片Operation:ToattachthedietothePCB操作：将芯片粘贴于印刷电路板上Aim:Tofixthedieforwirebonding,forelectricalconnectionandthermaldissipation目的：为了焊线工序固定芯片位置，同时实现导电和导热BGAprocessflowpresentationWireBond焊线Operation:Bondingwiresonthedieandbondingfingers操作：在芯片焊区与印刷电路板焊区之间焊线Aim:Toconnectthebondingpadsofthedietothebondingfingersofthesubstrate,toelectricallylinkthedietoexternalcircuit目的：连接芯片焊点和印刷电路板焊点，进而可以通过锡球连接外部电路BGAprocessflowpresentationMolding模封Operation:Toencapsulatethesubstrateandthebondeddieinamoldcompound操作：将部分PCB和焊线后的芯片封装于模封料内Aim:Toprotectthedieandthebondingwiresfromexternalphysical/chemicaldamage.目的：防止芯片和引线受到外部物理/化学的损伤BGAprocessflowpresentationMarking打印Operation:Tolaserengravethemoldcompound操作：在模封表面进行激光打印Aim:Tomarkwithsalestype,andtraceabilitycode目的：确保打印正确的销售类型，和追溯代码BGAprocessflowpresentationSolderBallsPlacement焊锡球Operation:Toplacesolderballsonthesolderballpads.操作：在放锡球区焊上锡球Aim:TomakeelectricalconnectioninterfacebetweeninternalcircuitandexternalPCB.目的：建立一个连接内部电路与外部电路板的连接点BGAprocessflowpresentationOperation:Tosingulateeachunit操作：将包含多个元件的PCB切割成单个元件Aim:TodeliverproductsthatcanbemountedandsolderedonPCB.目的：提供可供安装焊接在电路板上的单个元件Singulation切割BGAprocessflowpresentationOperation:Totestandclassifydevices.操作：将元件测试分类Aim:Toensureelectricalfunctionofdevices,correctsalestype.目的：确保元件电性能和正确的销售类型。Testing测试AcceptRejectBGAprocessflowpresentationOperation:Topackthedevicesintothereelandthereelintoinnerbox.操作：将元件装入包装带后装入包装盒内Aim:ToprovidephysicalandESDprotectionduringhandlingandtransportation目的：在处理和搬运过程中防止物理或静电损伤Packing包装
