AEC_Q100001_rev_C

AEC - Q100-001 - REV-COctober 8, 1998Component Technical CommitteeAutomotive Electronics CouncilATTACHMENT 1AEC - Q100-001 REV-CWIRE BOND SHEAR TEST AEC - Q100-001 - REV-C October 8, 1998 Component Technical CommitteeAutomotive Electronics Council Acknow ledgment Any document involving a complex technology brings together experience and skills from many sources. The Automotive Electronics Counsel would especially like to recognize the following significant contributors to the development of this document: James T. Peace DaimlerChrysler Robert V. Knoell Visteon Corporation Gerald E. Servais Delphi Delco Electronics Systems - Retired Mark A. Kelly Delphi Delco Electronics Systems AEC - Q100-001 - REV-COctober 8, 1998Component Technical CommitteeAutomotive Electronics CouncilChange NotificationThe following summary details the changes incorporated into AEC-Q100-001 Rev-C:• Section 1.3.4.4, Type 4 - Die Surface Contact: Corrected wording to reflect bond sheartype where the shear tool contacts the die surface, rather than the bonding surface asstated in Rev - B. • Added new Section 1.3.5, Footprint: Added new definition for “footprint”; changednumbers of subsequent sections to reflect the addition. • Section 3.6 step b, Footprint Inspection of Aluminum Wedge/Stitch Bonds: Addedwording to clarify method used to remove wire for footprint inspection. • Figure 3, Wire Bond Shear Types: Updated figure to reflect wording correction made toType 4 - Die Surface Contact.• Minor wording changes were made to the following: Section 1.1, 1.3.1, 1.3.4.1, 1.3.4.5, 2.2,2.5, 3.2, and 3.5.AEC - Q100-001 - REV-COctober 8, 1998Component Technical CommitteeAutomotive Electronics CouncilPage 1 of 11METHOD - 001WIRE BOND SHEAR TESTText enhancements...