封装形式图片国际统一简称封装形式图片国际统一简称TSOPLDCCThinSmall OUtlinePackageQFPLQFPLGAQuadPDIPFlat PackagePQFP 100LTO5QFPTO52QuadFlat PackageTO71SOT143TO71SOT220TO78Thin ShrinkPGAPlastic PIN GridQutline PackageArrayuBGA
PLCCMicro Ball GridArrayLQFPuBGAMicro Ball GridLQFP 100LArrayTO8PCDIPZIPTO92Zig-ZagInline PackaTO93SOT223T099SOT223EBGA 680LSOT23QFPSOT23/SOT323QuadFlat PackageSOT25/SOT353TQFP 100L
SBGASOT26/SOT363LBGA 160LFBGAPBGA 217LFDIPPlastic Ball GridArraySOJSBGA 192LSOP EIAJTYPE II 14LTSBGA 680LSSOP 16LCLCCSSOPSC-705LSOJ 32LSDIPFlat PackSIPSingleHSOP28Inline Package
SOITO220Small OutlinePackageITO3PCNRTO220CPGACeramic Pin OutlineTO247PackageDIPTO264DualInline PackageTO3DIP-tabDUAL Inline Package with MetalHeatsinkJLCCLCCBQFP 132TO263/TO268C-BendSO DIMMSmall Outline DualLeadIn-line Memory
CERQUADModule