DRT-210RealTemp©200ManualVersion1.1April2008AboutVeecoVeecoInstrumentsprovidesspecializedtechnicalproductsandservices(demonstratedonhttp:\\www.Veeco.com).Veeco’sTurboDiscMOCVDSystems,locatedinSomerset,NJ,developsandmanufacturesMOCVDdevicesforclientsthroughouttheworld.CopyrightNoticeTurboDisc©,RealTemp©200,EpiViser©andCarrierDesigner©arecopyrightedtrademarkpropertiesofVeecoCompoundSemiconductorInc.Copyright©2008,VeecoCompoundSemiconductorInc.Allrightsreserved.TurboDiscMOCVDSystems394ElizabethAvenueSomerset,NJ08873Phone:(732)560-5300VersionDoc.VersionNumberRevisionDatePagesAffectedChangeVersion1.0n/aInitialReleaseVersion1.14-14-082-17FilesettingsdataaddedDisclaimersandLegalNoticesThisdocumentdescribestheproper,safeoperationandmaintenancepracticesofhighlycomplextechnicalequipment.Everyefforthasbeenmadetoincludecompliantinstructions,warningsandguidelinestoensurethesafeandproductiveuseofthesystemsdescribedinthisdocument.VeecoTechnicalPublicationshascarefullyreviewedthisdocumenttoensureitsreliabilityandcompleteness.Ifyoudiscoveranyerrorsoromissions,pleasecontact:VeecoTechnicalPublicationsmailto:techpubs@veeco.comRealTemp©200ManualPageiCopyright©2008VeecoCompoundSemiconductorInc.AllRightsReservedContentsCHAPTER1.GENERALINFORMATION..........................................1-1SECTION1.1DEVICEDESCRIPTIONANDBASICPARAMETERS......................................................1-1SECTION1.1.OVERVIEW:THEBASICSOFEMISSIVITYCOMPENSATEDPYROMETRY..........................1-4OpaqueSubstrates.........................................................................................................1-6TransparentSubstrates..................................................................................................1-6WafercarrierandDiffuseReflectance............................................................................1-6CHAPTER2.OPERATINGPROCEDURES........................................2-1SECTION2.1.GENERALOPERATINGINFORMATION....................................................................2-1LoginLevels...................................................................................................................2-1OperatingScreenandControlLayout............................................................................2-1SECTION2.2.QUICKSTARTINPRODUCTIONMODE(OPERATORLEVEL).........................................2-4AutomaticSTART/STOP..................................................................................................2-5ManualSTART................................................................................................................2-6SECTION2.3.EVENTSATSTARTOFRUN................................................................................2-7SECTION2.4.MEASURINGWAFERCARRIERTEMPERATURE........................................................2-8SECTION2.5.ADJUSTABLEPARAMETERSDURINGRUN............................................................2-10WaferChart..................................................................................................................2-10Content........................................................................................................................2-10ScaleSettings..............................................................................................................2-12TemplateShow/Hide....
