机器视觉系统论文 半导体晶片切割的机器视觉系统摘要：机器视觉系统在工业中已经广泛使用，本课题讨论了机器视觉系统运用于半导体晶片切割的工业流程。在选取合适的摄像机和图像采集卡前提下，成功猎取了清楚的半导体晶片原始图像；然后利用 halcon 软件首先运用傅立叶变换猎取原始图像的自相关图像从而得到晶片的宽和高，然后通过匹配算法构建匹配模型，最后与原始图像进行匹配后计算出晶片的切割线来完成晶片的切割定位。这样即完成了一套半导体晶片的自动切割的流程，本课题的实现大大的提升了半导体晶片切割的速率。关键词：机器视觉；傅立叶变换；模板匹配；HalconThe WaferDicing Based on Machine Vision TechnologyAbstract: Machine vision system has been widely used in industry, this topic studied machine vision system used in semiconductor wafer cut industrial process. In selecting the right camera and image acquisition card, acquire clear success original image; semiconductor chips Then halcon software first by using Fourier transform of the original image acquisition from relevant images and get a chip in width and height, and then through the matching algorithm, and finally construct matching model with the original image matching of wafer calculated out after cutting line to complete the chip's cutting positioning. Namely so completed a set of semiconductor chip the flow of automatic cutting, so greatly promoted semiconductor wafer cutting speed. So this topic research now is widely used in industrial production.Key words: machine vision, Fourier transform, template matching, Halcon目录第 1 章 前言.........................................................................................................................41.1 选题背景................................................................................................................41.2 选题目的和意义....................................................................................................41....
