DuPontPhotovoltaicSolutions©DuPontLatestdevelopmentsinthin-filmencapsulanttechnologyAugust18,2011J
KimRegionalTechnicalServicesLeaderMaterialsCostImpactonPVCells&ModulesCrystallineSiliconThinFilmSiliconMetal(51%)BillofMaterialsMetallizationPastes(12%)BacksheetFilm(8%)FrontGlass(6%)EncapFilm(6%)JunctionBox(5%)OtherMat’ls(12%)TCOFrontGlass(29%)ModuleFrame(25%)GlassorBacksheet(13%)Gases&Targets(11%)EncapsulantFilm(7%)JunctionBox(6%)ReflectorPaint(4%)ConductiveRibbon(1%)OtherMaterials(4%)Withencapsulantsatonly6-7%ofmodulecost,thelargestcostimpactcomesfromchoosingtheoptimalencapsulanttoenableoverallsystemcostreductionsExamplesofRequiredEncapsulantAttributesDurability25yearsnodelaminationCellefficiencyoverlifeofmoduleMeetsoperatingtemperaturerequirementsLowSystemCostCompatibilitywithTopCoatMat