理想狀況(TargetCondition)理想狀況(TargetCondition)拒收狀況(RejectCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件X方向)SMDAssemblyworkmanshipcriteria--Chipcomponentalignment(XAxis)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.1.零件橫向超出焊墊以外，但尚未大於其零件寬度的50%。(X1/2W)≦1.Thecomponentshiftedoffthepadandshiftlengthshallless1/2chipwidth1.零件已橫向超出焊墊，大於零件寬度的50%(MI)。(X>1/2W)1.Thecomponentshiftedoffthepadandshiftlengthover1/2chipwith允收狀況(AcceptCondition)允收狀況(AcceptCondition)X1/2W≦X1/2W≦330X>1/2WX>1/2W註:此標準適用於三面或五面之晶片狀零件Thisstandardonlybeusedfor3or5faceterminationschipcomponentww330330理想狀況(TargetCondition)理想狀況(TargetCondition)拒收狀況(RejectCondition)拒收狀況(RejectCondition)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.1.零件縱向偏移，但焊墊尚保有其零件寬度的25%以上。(Y11/4W)≧2.零件縱向偏移，但零件端電極仍蓋住焊墊為其零件寬度的25%以上。(Y21/4W)≧Componentisshiftedtowardslongestpartofthechip,butthetermiuadendofchipstillontheland1.ThePadlengthnotbecoverbychip(Y1)shallover1/4chipwidth(W)2.1/4widthofthelandforsolderfillettoform.1.零件縱向偏移，但焊墊未保有其零件寬度的25%(MI)。(Y1＜1/4W)2.零件縱向偏移，但零件端電極蓋住焊墊小於其零件寬度的25%。(Y2＜1/4W)3.Whicheverisrejected.允收狀況(AcceptCondition)允收狀況(AcceptCondition)WW330330Y21/4W≧330Y1＜1/4WY2＜1/4WY11/4W≧SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件Y方向)SMDAssemblyworkmanshipcriteria--Chipcomponentalignment(YAxis)理想狀況(TargetCondition)理想狀況(TargetCondition)拒收狀況(RejectCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳面之對準度SMDAssemblyworkmanshipcriteria--Gull-Wingfootprintalignment1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X≦1/2W)2.偏移接腳之邊緣與焊墊外≧緣之垂直距離5mil(0.13mm)。(S≧5mil)1.Thelengthoftheleadfootprintshiftedofftheland(X)shallless1/2widthoflead2.Theclearance(S)betweenleadshiftedoffandlandshallover5mil允收狀況(AcceptCondition)允收狀況(AcceptCondition)WSX≦1/2WS≧5milX>1/2WS＜5mil1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X＞1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離＜5mil(0.13mm)(MI)。(S＜5mil)3.Whicheverisrejected.理想狀況(TargetCondition)理想狀況(TargetCondition)拒收狀況(RejectCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳趾之對準度SMDAssemblyworkmanshipcriteria--Gull-Wingtoealingnment1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣。1.Theleadhadshiftedandfootprintnotovertheendofland1.各接腳側端外緣，已超過焊墊側端外緣(MI)。1.Theleadhadshiftedandfootprinthadovertheendofland(MI)允收狀況(AcceptCondition)允收狀況(AcceptCondition)WW已超過焊墊側端外緣理想狀況(TargetCondition)理想狀況(TargetCondition)拒收狀況(RejectCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳跟之對準度SMDAssemblyworkmanshipcriteria--Gull-Wingh...
